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VLSI Design: Circuits, Systems and Applications : Select Proceedings of ICNETS2, Volume V / edited by Jie Li, A Ravi Sankar, P Augusta Sophy Beulet.
by SpringerLink (Online service) | Li, Jie | Sankar, A Ravi, editor literario | Beulet, P Augusta Sophy, editor literario. Material type: E-book Publisher: Singapore : Springer International Publishing, 2018Items
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Call no. |
Status |
Vol info |
Loan type |
| Acceso Electrónico (UEM) |
TK7874.75 2018 EB |
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Silicon Analog Components Device Design, Process Integration, Characterization, and Reliability / by Badih El-Kareh, Lou N. Hutter.
by El-Kareh, Badih, autor. | Hutter, Lou N, autor.. Material type: E-book Publisher: New York, NY : Springer International Publishing, 2015Items
| Location |
Call no. |
Status |
Vol info |
Loan type |
| Acceso Electrónico (UEM) |
TK7874 .E453 2015 EB |
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Multi-Net Optimization of VLSI Interconnect / by Konstantin Moiseev, Avinoam Kolodny, Shmuel Wimer.
by Moiseev, Konstantin, autor. | Kolodny, Avinoam, autor. | Wimer, Shmuel, autor.. Material type: E-book Publisher: New York, NY : Springer International Publishing, 2015Items
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Call no. |
Status |
Vol info |
Loan type |
| Acceso Electrónico (UEM) |
TK7874.53 2015 EB |
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Circuit Design for Reliability / edited by Ricardo Reis, Yu Cao, Gilson Wirth.
by Reis, Ricardo, editor literario | Cao, Yu, editor literario | Wirth, Gilson, editor literario. Material type: E-book Publisher: New York, NY : Springer International Publishing, 2015Items
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Call no. |
Status |
Vol info |
Loan type |
| Acceso Electrónico (UEM) |
TK7874 2015 EB |
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On-Chip Electro-Static Discharge (ESD) Protection for Radio-Frequency Integrated Circuits / by Qiang Cui, Juin J. Liou, Jean-Jacques Hajjar, Javier Salcedo, Yuanzhong Zhou, Parthasarathy Srivatsan.
by Cui, Qiang, autor | Liou, Juin J, autor | Hajjar, Jean-Jacques, autor | Salcedo, Javier, autor | Zhou, Yuanzhong, autor | Srivatsan, Parthasarathy, autor. Material type: E-book Publisher: Cham : Springer International Publishing, 2015Items
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Call no. |
Status |
Vol info |
Loan type |
| Acceso Electrónico (UEM) |
TK7874.78 2015 EB |
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Fan-Out Wafer-Level Packaging / by John H. Lau.
by SpringerLink (Online service) | Lau, John H, autor. Material type: E-book Publisher: Singapore : Springer Singapore : Imprint: Springer, 2018Items
| Location |
Call no. |
Status |
Vol info |
Loan type |
| Acceso Electrónico (UEM) |
TK7870.17 2018 EB |
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Ultra Low Power ECG Processing System for IoT Devices / by Temesghen Tekeste Habte, Hani Saleh, Baker Mohammad, Mohammed Ismail.
by SpringerLink (Online service) | Tekeste Habte, Temesghen, autor | Ismail, Mohammed, autor | Mohammad, Baker, autor | Saleh, Hani, autor. Material type: E-book Publisher: Cham : Imprint: Springer, 2019Items
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Loan type |
| Acceso Electrónico (UEM) |
TK7895.E42 2019 EB |
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Low-Power Millimeter Wave Transmitters for High Data Rate Applications / Khaled Khalaf, Vojkan Vidojkovic, John R. Long, Piet Wambacq.
by SpringerLink (Online service) | Khalaf, Khaled, autor | Long, John R, autor | Vidojkovic, Vojkan, autor | Wambacq, Piet, autor. Material type: E-book Publisher: Cham : Springer International Publishing : Imprint: Springer, 2019Items
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Vol info |
Loan type |
| Acceso Electrónico (UEM) |
TK7874.66 2019 EB |
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Bits on Chips / by Harry Veendrick.
by SpringerLink (Online service) | Veendrick, H. J. M.(Harry J. M.), autor. Edition: 2nd ed. 2019.Material type: E-book Publisher: Cham : Springer International Publishing : Imprint: Springer, 2019Items
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Call no. |
Status |
Vol info |
Loan type |
| Acceso Electrónico (UEM) |
TK7874 2019 EB |
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