000			03003cam a2200385Ii 4500
999			_c95935 _d95935 _x1
001			95935
003			ES-MaUEC
005			20230102112729.0
006			m o d
007			cr cn|||||||||
008			170505s2017 sz a ob 000 0 eng d
020			_a3319475975 _q(electronic bk.)
020			_a9783319475974 _q(electronic bk.)
020			_z3319475959
020			_z9783319475950 _q(print)
040			_aLGG _cLGG _dGW5XE _dYDX _dUAB _dESU _dOCLCF _dNJR _dCOO _dOTZ _dIOG _dU3W _dES-MaUEC _bspa
050		4	_aTK7871.99.M44 _bV446 2017 EB
100	1		_aVeendrick, H. J. M. _q(Harry J. M.), _eautor
245	1	0	_aNanometer CMOS ICs : _bfrom basics to ASICs _cHarry J. M. Veendrick.
250			_aSecond edition.
264		1	_aCham _bSpringer _c2017.
300			_a1 recurso en línea (xxxvii, 595 páginas) _bilustraciones (algunas a color)
336			_aTexto _btxt _2rdacontent
337			_aelectrónico _bc _2rdamedia
338			_arecurso electrónico _bcr _2rdacarrier
500			_aSpringerLink
504			_aIncluye referencias bibliográficas e índice
505	0		_aBasic Principles -- Geometrical-, Physical- and Field-Scaling Impact on MOS Transistor Behavior -- Manufacture of MOS Devices -- CMOS Circuits -- Special Circuits, Devices and Technologies -- Memories -- Very Large Scale Integration (VLSI) and ASICs -- Low Power, a Hot Topic in IC Design -- Robustness of Nanometer CMOS Designs: Signal Integrity, Variability and Reliability -- Testing, Yield, Packaging, Debug and Failure Analysis -- Effects of Scaling on MOS IC Design and Consequences for the Roadmap.
520	3		_aThis textbook provides a comprehensive, fully-updated introduction to the essentials of nanometer CMOS integrated circuits. It includes aspects of scaling to even beyond 12nm CMOS technologies and designs. It clearly describes the fundamental CMOS operating principles and presents substantial insight into the various aspects of design implementation and application. Coverage includes all associated disciplines of nanometer CMOS ICs, including physics, lithography, technology, design, memories, VLSI, power consumption, variability, reliability and signal integrity, testing, yield, failure analysis, packaging, scaling trends and road blocks. The text is based upon in-house Philips, NXP Semiconductors, Applied Materials, ASML, IMEC, ST-Ericsson, TSMC, etc., courseware, which, to date, has been completed by more than 4500 engineers working in a large variety of related disciplines: architecture, design, test, fabrication process, packaging, failure analysis and software.
988			_aEBOOK, asignarmaterias, EBSPRINGER_2017D
650		7	_aCircuitos integrados _xDiseño y construcción _2embne _0(OCoLC)fst00811719 _0 _9179611
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=http://link.springer.com/10.1007/978-3-319-47597-4 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
942			_2lcc _cLE
998			_b02/2018 _dz _e- _zSI