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007			cr cnu|||unuuu
008			170322s2017 sz a ob 000 0 eng d
020			_a3319547143 _q(electronic bk.)
020			_a9783319547145 _q(electronic bk.)
020			_z3319547135
020			_z9783319547138 _q(print)
040			_aN$T _cN$T _dGW5XE _dN$T _dYDX _dEBLCP _dOCLCQ _dNJR _dUAB _dOCLCF _dIOG _dCOO _dAZU _dUPM _dESU _dVT2 _dJBG _dIAD _dICW _dICN _dOTZ _dOCLCQ _dIDB _dU3W _dMERUC _dES-MaUEC _bspa
050		4	_aTK7874 _b.W364 2017 EB
100	1		_aWang, Ran, _eautor
245	1	0	_aTesting of interposer-based 2.5D integrated circuits _cRan Wang, Krishnendu Chakrabarty.
264		1	_aCham, Switzerland _bSpringer _c2017.
300			_a1 recurso en línea (xiv, 182 páginas) _bilustraciones (algunas a color)
336			_aTexto _btxt _2rdacontent
337			_aelectrónico _bc _2rdamedia
338			_arecurso electrónico _bcr _2rdacarrier
347			_atext file _bPDF _2rda
500			_aSpringerLink _bSpringer Engineering eBooks 2017 English+International
504			_aIncluye referencias bibliográficas
505	0		_aPreface; Acknowledgements; Contents; 1 Introduction; 1.1 The Evolution of 2.5D ICs; 1.1.1 3D ICs: A Paradigm Shift from Traditional Integrated Circuits; 1.1.2 2.5D ICs: An Alternative to 3D ICs; 1.2 Research Challenges and Motivation; 1.2.1 Pre-bond Interposer Testing; 1.2.2 Lack of Test Access; 1.2.3 Limited Ability for At-Speed Testing; 1.2.4 High-Density I/O Ports and Interconnects; 1.2.5 Reduced Number of Test Pins; 1.2.6 High Power Consumption; 1.3 Emerging Solutions for the Testing of 2.5D ICs; 1.4 Outline of the Book; References; 2 Pre-bond Testing of the Silicon Interposer.
505	8		_a2.1 Background2.2 Proposed Test Architecture and Procedures; 2.2.1 Definition of Die Footprint; 2.2.2 Test Architecture; 2.2.3 Assembly and Test Flow; 2.2.4 Test Procedures; 2.2.5 Weighted Critical Area; 2.3 Test-Path Design; 2.3.1 Optimization Problem; 2.3.2 Proposed Algorithm; 2.4 Experimental Results; 2.4.1 Testing the Horizontal Interconnects; 2.4.2 Testing for Vertical Interconnects; 2.4.3 Evaluation of the Test-Path Design Method; 2.5 Conclusion; References; 3 Post-bond Scan-Based Testing of Interposer Interconnects; 3.1 Problem Statement; 3.2 Proposed Test Architecture.
505	8		_a3.3 Test Application3.3.1 Open/Short-Defect Testing; 3.3.2 Delay-Defect Testing; 3.3.3 Test Structures for Bi-directional I/Os; 3.4 Integration with IEEE 1149.1; 3.5 Simulation Results; 3.5.1 Detection Capability for Open Defects; 3.5.2 Detection Capability for Short Defects; 3.5.3 Detection Capability for Delay Defects; 3.5.4 Architecture Simulation; 3.5.5 Area Overhead; 3.6 Conclusion; References; 4 Test Architecture and Test-Path Scheduling; 4.1 Proposed Test Architecture; 4.1.1 Boundary-Scan Structure; 4.1.2 Modified TAP Controller; 4.1.3 Boundary-Scan Cells and Circuit Block.
505	8		_a4.1.4 Test Procedures4.2 Test-Path Design and Scheduling; 4.2.1 Structure of Additional Test Paths; 4.2.2 Minimization of Total Interconnect Test Cost; 4.2.3 Optimization in Alternative Scenarios; 4.2.4 Placement of Dies on the Test Path; 4.3 Simulation Results; 4.3.1 Test Architecture Simulation Results; 4.3.2 Case Study; 4.3.3 Area Overhead; 4.3.4 Test-Path Design and Scheduling Results; 4.4 Conclusion; References; 5 Built-In Self-Test; 5.1 Related Prior Work; 5.2 Proposed BIST Architecture; 5.3 BIST Components; 5.3.1 Self-configuration of the In-BSC; 5.3.2 Pattern Generator.
505	8		_a5.3.3 Response Compactor5.3.4 BIST Controller; 5.4 Test Scheduling and Optimization; 5.5 Simulation Results; 5.5.1 BIST Architecture Simulation; 5.5.2 Case Study; 5.5.3 Overhead Analysis; 5.5.4 Test Scheduling Results; 5.6 Conclusion; References; 6 ExTest Scheduling and Optimization; 6.1 Problem Statement; 6.2 Test Architecture and Current Solution; 6.3 Proposed Scheduling Strategies; 6.3.1 Scheduling Strategy for SoC Dies with Dedicated Wrappers; 6.3.2 Scheduling Strategy for Extremely Large SoC Dies; 6.4 Schedule Optimization; 6.4.1 Sharing of Inputs; 6.4.2 Output Removal.
520	3		_aThis book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable. Provides a single-source guide to the practical challenges in testing of 2.5D ICs; Presents an efficient method to locate defects in a passive interposer before stacking; Describes an efficient interconnect-test solution to target through-silicon vias (TSVs), the redistribution layer, and micro-bumps for shorts, opens, and delay faults; Provides a built-in self-test (BIST) architecture that can be enabled by the standard TAP controller in the IEEE 1149.1 standard; Discusses two ExTest scheduling strategies to implement interconnect testing between tiles inside an SoC die; Includes a programmable method for shift-clock stagger assignment to reduce power supply noise during SoC die testing in 2.5D ICs.
650		7	_aCircuitos integrados _2embne _0(OCoLC)fst00975535 _0 _9139614
700	1		_aChakrabarty, Krishnendu, _eautor
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=http://link.springer.com/10.1007/978-3-319-54714-5 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
988			_aEBOOK, asignarmaterias, EBSPRINGER_2017C
998			_b02/2018 _dz _e- _zSI
999			_c95633 _d95633 _x1