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008			170322s2017 sz a o 001 0 eng d
020			_a3319516973 _q(electronic bk.)
020			_a9783319516974 _q(electronic bk.)
020			_z3319516965
020			_z9783319516967 _q(print)
040			_aGW5XE _cGW5XE _dN$T _dYDX _dEBLCP _dIDEBK _dOCLCF _dIOG _dCOO _dAZU _dUPM _dUAB _dESU _dJBG _dIAD _dICW _dICN _dOTZ _dVT2 _dOCLCQ _dIDB _dU3W _dMERUC _dES-MaUEC _bspa
050		4	_aTK7870.15 _bR436 2017 EB
245	0	0	_aRF and microwave microelectronics packaging II _cKen Kuang, Rick Sturdivant, editors.
264		1	_aCham, Switzerland _bSpringer _c2017.
300			_a1 recurso en línea (xii, 172 páginas) _bilustraciones (algunas a color)
336			_aTexto _btxt _2rdacontent
337			_aelectrónico _bc _2rdamedia
338			_arecurso electrónico _bcr _2rdacarrier
347			_atext file _bPDF _2rda
500			_aIncluye índice
500			_aSpringerLink _bSpringer Engineering eBooks 2017 English+International
505	0		_aDedication; Foreword; Foreword; Contents; Chapter 1: Introduction to Radio Frequency and Microwave Microelectronic Packaging; 1.1 Introduction; 1.2 Frequency Bands; 1.3 Distributed Effects; 1.4 Transmission Lines; 1.5 Commonly Used Transmission Lines; 1.6 Dispersion in Transmission Lines; 1.7 Dielectric and Substrate Materials; 1.8 Skin Depth; 1.9 Thermal Conductivity, Electrical Conductivity, and Thermal Expansion; 1.10 Chapter Conclusions; References; Chapter 2: Packaging of Transmit/Receive Modules; 2.1 Introduction to Packaging of Transmit/Receive Modules.
505	8		_a2.1.1 Active Electronically Scanned Arrays2.1.2 T/R Module Block Diagram; 2.2 Systems Using T/R Modules; 2.3 T/R Modules in Communication Systems; 2.3.1 Cellular Base Stations; 2.3.2 Wi-Fi Indoor Location Systems Using Phased Arrays; 2.3.3 60 GHz Wi-Fi; 2.3.4 Millimeter-Wave Point-to-Point Systems; 2.4 T/R Modules in Phased Array Radar; 2.4.1 Brick Array; 2.4.2 Tile Array; 2.4.3 Panel Array; 2.5 Thermal Packaging Challenges; 2.6 Wafer Level T/R Module Packaging; 2.7 Conclusions; References; Chapter 3: 3D Transitions and Connections; 3.1 Introduction.
505	8		_a3.2 Vertical Transitions Between Planar Transmission Lines3.2.1 Microstrip or Coplanar Waveguide to Stripline; 3.2.2 Top Side Microstrip to Bottom Side Microstrip; 3.2.3 Microstrip to Waveguide Transition; 3.3 Through Silicon Via 3D Transitions; 3.4 Vertical Transitions Using Connectors; 3.5 Vertical Transition Using Flip Chip; 3.6 Conclusions; References; Chapter 4: Electromagnetic Shielding for RF and Microwave Packages; 4.1 Introduction; 4.2 Electromagnetic Radiation; 4.2.1 The Source of Radiation; 4.2.2 How an Antenna Radiates Electric and Magnetic Fields.
505	8		_a4.2.3 Theoretical View of Radiation4.2.4 Electromagnetic Simulation and Computational Method; 4.2.4.1 The Finite Element Method; 4.2.4.2 Method of Moments; 4.2.4.3 Finite-Difference Time-Domain; 4.2.4.4 Finite-Differences Frequency-Domain ; 4.3 Shielding Techniques and Methods; 4.3.1 Metal Caps; 4.3.2 Plating; 4.3.3 Spray Coating; 4.3.4 Sputtering; 4.4 Shielding Performance of Thin-layer Conformal Shielding; 4.4.1 Shielding Performance Measurement Methods; 4.4.2 Test Vehicles; 4.4.3 Shielding Effectiveness; 4.4.4 Far-field Shielding Performance Measurements.
505	8		_a4.4.5 Near-field Shielding Performance Measurements4.5 Summary; References; Chapter 5: Design of C-Band Interdigital Filter and Compact C-Band Hairpin Bandpass Film Filter on Thin Film Substrate; 5.1 Introduction; 5.2 Microstrip Filter; 5.3 Design of the Interdigital Filter; 5.3.1 Structure of the Filter; 5.3.2 The Simulation Analysis; 5.3.3 The Test Results; 5.4 Design of the Hairpin Filter; 5.4.1 Structure of the Filter; 5.4.2 The Simulation Analysis; 5.4.3 The Test Results; 5.5 Conclusion; References.
520	3		_aReviews RF, microwave, and microelectronics assembly process, quality control, and failure analysis Bridges the gap between low cost commercial and hi-res RF/Microwave packaging technologies Engages in an in-depth discussion of challenges in packaging and assembly of advanced high-power amplifiers This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to "RF and Microwave Microelectronics Packaging" (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.
650		7	_aComponentes electrónicos _2embne _0(OCoLC)fst01019751 _0 _9153705
700	1		_aKuang, Ken, _eeditor literario
700	1		_aSturdivant, Rick, _eeditor literario
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=http://link.springer.com/10.1007/978-3-319-51697-4 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
988			_aEBOOK, asignarmaterias, EBSPRINGER_2017C
998			_b02/2018 _dz _e- _zSI
999			_c95625 _d95625 _x1