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007			cr |n|||||||||
008			170228s2017 sz a o 000 0 eng d
020			_a3319508245 _q(electronic bk.)
020			_a9783319508245 _q(electronic bk.)
020			_z3319508229
020			_z9783319508221
040			_aYDX _cYDX _dGW5XE _dNJR _dN$T _dIDEBK _dEBLCP _dN$T _dOCLCF _dCOO _dUAB _dAZU _dUWO _dIOG _dUPM _dMERER _dESU _dZ5A _dOCLCQ _dJBG _dIAD _dICW _dICN _dOTZ _dOCLCQ _dU3W _dES-MaUEC _bspa
050		4	_aT174.7 _bO985 2017 EB
245	0	0	_aOutlook and challenges of nano devices, sensors, and MEMS _cTing Li, Ziv Liu, editors.
264		1	_aCham _bSpringer _c2017.
300			_a1 recurso en línea _bilustraciones (algunas a color)
336			_aTexto _btxt _2rdacontent
337			_aelectrónico _bc _2rdamedia
338			_arecurso electrónico _bcr _2rdacarrier
347			_atext file _bPDF _2rda
500			_aSpringerLink _bSpringer Engineering eBooks 2017 English+International
505	0		_aIntroduction -- High-k dielectric for nanoscale MOS devices -- Performance, optimization, and reliability of FinFET devices -- Performance, optimization, and challenges of emerging nanowire field-effect transistors -- Graphene technology for future MEMS and sensor applications -- Nanoscale sensors for next-generation optical transceiver applications -- Nanoscale MEMS for future optical communication applications -- Nanoscale devices for biomedical applications -- Effect of nanoscale structure on reliability of nano devices and sensors -- Compact modeling of nano devices and sensors -- Three-dimensional TCAD simulation of nano semiconductor devices -- Fabrication of nano devices based on novel material -- Novel processing technology for fabricating nano devices and sensors -- Conclusions.
520	3		_aThis book provides readers with an overview of the design, fabrication, simulation, and reliability of nanoscale semiconductor devices, MEMS, and sensors, as they serve for realizing the next-generation internet of things. The authors focus on how the nanoscale structures interact with the electrical and/or optical performance, how to find optimal solutions to achieve the best outcome, how these apparatus can be designed via models and simulations, how to improve reliability, and what are the possible challenges and roadblocks moving forward.
650		7	_aElectrónica _2embne _0(OCoLC)fst01019745 _0 _9138690
700	1		_aLi, Ting.
700	1		_aLiu, Ziv.
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=http://link.springer.com/10.1007/978-3-319-50824-5 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
988			_aEBOOK, asignarmaterias, EBSPRINGER_2017C
998			_b02/2018 _dz _e- _zSI
999			_c95474 _d95474 _x1