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008			170208s2017 si o 101 0 eng d
020			_a9789811027178 _q(electronic bk.)
020			_a981102717X _q(electronic bk.)
020			_z9789811027161 _q(print)
020			_z9811027161
035			_a(OCoLC)971613358 _z(OCoLC)972113556 _z(OCoLC)972252396 _z(OCoLC)972441307 _z(OCoLC)972580759 _z(OCoLC)981863549 _z(OCoLC)1005809430 _z(OCoLC)1012016612
040			_aN$T _cN$T _dEBLCP _dGW5XE _dN$T _dOCLCO _dYDX _dOCLCF _dNJR _dUAB _dCOO _dIOG _dAZU _dUWO _dUPM _dESU _dZ5A _dJBG _dIAD _dICW _dICN _dILO _dOTZ _dOCLCQ _dVT2 _dU3W _dES-MaUEC _bspa
050		4	_aTA5 _b.T736 2017 EB
111	2		_aWorld Congress on Engineering and Computer Science _d(2015 : _cSan Francisco, Calif.)
245	1	0	_aTransactions on engineering technologies : _bWorld Congress on Engineering and Computer Science 2015 _cSio-Iong Ao, Haeng Kon Kim, Mahyar A. Amouzegar, editors.
264		1	_aSingapore _bSpringer _c[2017]
300			_a1 recurso en línea
336			_aTexto _btxt _2rdacontent
337			_aelectrónico _bc _2rdamedia
338			_arecurso electrónico _bcr _2rdacarrier
347			_atext file _bPDF _2rda
500			_aIncludes indexes.
500			_aSpringerLink _bSpringer Engineering eBooks 2017 English+International
505	0		_aPreface; Contents; 1 Estimate the Impact of Different Heat Capacity Approximation Methods on the Numerical Results During Computer Simulation of Solidification; 1.1 Introduction; 1.2 Description of the Entalphy Formulation; 1.2.1 The Enthalpy and the Effective Heat Capacity; 1.2.2 The Types of the Entalphy Formulations; 1.3 Approximation of the Effective Heat Capacity; 1.4 Numerical Model of Solidification; 1.5 Used Software of Engineering Simulation; 1.6 Results of the Numerical Experiment; 1.7 Conclusions; References.
505	8		_a2 Analysis of Systemic Risk: A Dynamic Vine Copula-Based ARMA-EGARCH Model2.1 Introduction; 2.2 Methodology; 2.2.1 Risk Methodology; 2.2.2 Univariate ARMA-EGARCH Model; 2.2.3 Sklar's Theory; 2.2.4 Parametric Copulas; 2.2.5 Vine Copulas; 2.2.6 Tail Dependence; 2.2.7 Estimation Method; 2.3 Data and Empirical Findings; 2.3.1 Data Representation; 2.3.2 Results for the Marginal Models; 2.3.3 Results for the Copula Models; 2.3.4 Results for the Copula VaR and Copula VaR Ratio; 2.4 Conclusion; References.
505	8		_a3 MOESP_AOKI_VAR: Algorithm for Space State Identification of Non-stationary Multivariable Noisy Linear Systems3.1 Introduction; 3.2 Foundation; 3.2.1 Stationary Deterministic Linear System; 3.2.2 Stationary Noisy Linear System; 3.2.3 Non-stationary Deterministic Linear System; 3.2.4 Non-stationary Noisy Linear System; 3.2.5 Time Variant Identification; 3.2.6 Deterministic-Stochastic Modelling of the State Space of Non-stationary System; 3.3 MOESP_AOKI_VAR Algorithm; 3.4 Experimentation and Results; 3.5 Conclusions; References; 4 Comparative the Performance of Control Charts Based on Copulas.
505	8		_a4.1 Introduction4.2 Research Methodology; 4.2.1 Multivariate Exponentially Weighted Moving Average Control Chart; 4.2.2 Double Multivariate Exponentially Weighted Moving Average Control Chart; 4.2.3 Multivariate Cumulative Sum Control Chart; 4.2.4 Copulas Concepts; 4.2.4.1 Normal Copula; 4.2.4.2 Archimedean Copulas; 4.2.5 Dependence and Kendall's tau; 4.3 Numerical Results; 4.4 Conclusion and Future Work; Acknowledgments; References; 5 Mamdani Fuzzy Decision Model for GIS-Based Landslide Hazard Mapping; 5.1 Introduction; 5.2 Theoretical Framework; 5.3 Methods; 5.3.1 Study Area.
505	8		_a5.3.2 Risk Indicators of Landslides5.3.3 Fuzzy Decision Model for Landslide Hazard Assessment; 5.3.3.1 Fuzzification of the Input Variables; 5.3.3.2 Rule Evaluation; 5.3.3.3 Aggregation of the Output Rules; 5.3.3.4 Defuzzification; 5.3.4 Geographic Information System for Landslide Hazard Mapping; 5.4 Results and Discussion; 5.5 Conclusion; 5.6 Recommendation; Acknowledgements; References; 6 Laser Scanning as a Tool for the Analysis of Historical Buildings; 6.1 Introduction; 6.2 2D Documentation; 6.3 Types of 3D Scanners.
520	3		_aThis proceedings volume contains selected revised and extended research articles written by researchers who participated in the World Congress on Engineering and Computer Science 2015, held in San Francisco, USA, 21-23 October 2015. Topics covered include engineering mathematics, electrical engineering, circuits, communications systems, computer science, chemical engineering, systems engineering, manufacturing engineering, and industrial applications. The book offers the reader an overview of the state of the art in engineering technologies, computer science, systems engineering and applications, and will serve as an excellent reference work for researchers and graduate students working in these fields.
650		7	_aInformática _2embne _0(OCoLC)fst00872451 _0 _9139268
700	1		_aAmouzegar, Mahyar A., _eeditor literario
700	1		_aAo, Sio-Iong, _eeditor literario
700	1		_aKim, Haeng-Kon, _eeditor literario
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=http://link.springer.com/10.1007/978-981-10-2717-8 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
988			_aEBOOK, asignarmaterias, EBSPRINGER_2017B
998			_b02/2018 _dz _e- _zSI
999			_c95341 _d95341 _x1