| 000 | 03370nam a22004335i 4500 | ||
|---|---|---|---|
| 999 |
_c86837 _d86837 _x1 |
||
| 001 | 86837 | ||
| 003 | ES-MaUEC | ||
| 005 | 20230207040617.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 160406s2016 si | s |||| 0|eng d | ||
| 020 | _a9789811008009 | ||
| 040 | _aES-MaUEC | ||
| 050 | 4 |
_aTK5981 _b.K387 2016 EB |
|
| 082 | 0 | 4 | _a620.5 |
| 100 | 1 |
_aKaushik, B. K. _0Local _9100865 |
|
| 245 | 1 | 0 |
_aCrosstalk in Modern On-Chip Interconnects : _bA FDTD Approach _cby BK Kaushik, V Ramesh Kumar, Amalendu Patnaik |
| 260 |
_aSingapore _bSpringer _c2016 |
||
| 300 | _a1 recurso en línea (XV, 116 p.) 71 il. | ||
| 336 |
_aTexto (visual) _btxt _2rdacontent |
||
| 337 |
_aelectrónico _bc _2rdamedia |
||
| 338 |
_arecurso electrónico _bcr _2rdacarrier |
||
| 338 |
_aonline resource _bcr _2rdacarrier |
||
| 490 | 1 |
_aSpringerBriefs in Applied Sciences and Technology _x2191-530X |
|
| 505 | 0 | _aIntroduction to On-chip Interconnects and Modeling -- Interconnect Modeling, CNT and GNR Structure, Properties and Characteristics -- FDTD Model for Crosstalk Analysis of CMOS Gate-Driven Coupled Copper Interconnects -- FDTD Model for Crosstalk Analysis of Multiwall Carbon Nanotube (MWCNT) Interconnects -- Crosstalk Modeling with Width Dependent MFP in MLGNR Interconnects Using FDTD Technique -- An Efficient US-FDTD Model for Crosstalk Analysis of On-chip Interconnects. | |
| 520 | _aThe book provides accurate FDTD models for on-chip interconnects, covering most recent advancements in materials and design. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for CNT and GNR based interconnects are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR-based interconnects are also discussed in the book. The proposed models are validated with the HSPICE simulations. The book introduces the current research scenario in the modeling of on-chip interconnects. It presents the structure, properties, and characteristics of graphene based on-chip interconnects and the FDTD modeling of Cu based on-chip interconnects. The model considers the non-linear effects of CMOS driver as well as the transmission line effects of interconnect line that includes coupling capacitance and mutual inductance effects. In a more realistic manner, the proposed model includes the effect of width-dependent MFP of the MLGNR while taking into account the edge roughness. | ||
| 650 | 7 |
_aNanotecnología _0comprobar BNE20011268513 _2embne _9158453 |
|
| 650 | 7 |
_aElectrónica _0comprobar BNE19900963053 _2embne _9138690 |
|
| 650 | 0 | 7 |
_aIngeniería _vCongresos y asambleas _0LocalX _2embne _9670301 |
| 700 | 1 |
_aKumar, V. Ramesh _0Local _9100866 |
|
| 700 | 1 |
_aPatnaik, Amalendu. _9100867 _0Local |
|
| 830 | 0 |
_aSpringerBriefs in Applied Sciences and Technology _x2191-530X _9134085 |
|
| 856 | 4 | 0 |
_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://link.springer.com/book/10.1007/978-981-10-0800-9 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid) |
| 901 | _ai9789811008009 | ||
| 907 |
_a.b12961152 _b10-10-17 _c21-11-16 |
||
| 942 |
_2lcc _cLE |
||
| 945 |
_aTK5981 .K387 2016 EB _g1 _ieBOOK _j0 _lmae _o- _pEUR0.00 _q- _r- _sb _t15 _u0 _v0 _w0 _x0 _y.i11602004 _z06-04-17 |
||
| 988 | 0 | 0 | _aEBOOK, EBSPRINGER |
| 998 |
_am _a_alco _a_vill _b - - _cm _dz _e- _feng _gsi _h0 |
||