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| 003 | ES-MaUEC | ||
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| 008 | 151031s2016 gw | s |||| 0|eng d | ||
| 020 | _a9783662488232 | ||
| 040 | _aES-MaUEC | ||
| 050 | 4 |
_aTK7836 _b.Z436 2016 |
|
| 082 | 0 | 4 | _a620.1 |
| 100 | 1 |
_aZhang, Qingke. _9100246 _0Local |
|
| 245 | 1 | 0 |
_aInvestigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces _cby Qingke Zhang |
| 250 | _a1st ed. | ||
| 260 |
_aBerlin, Heidelberg _bSpringer Berlin Heidelberg _c2016 |
||
| 300 |
_a1 recurso en línea (XV, 143 páginas) _b115 ilustraciones, 81 ilustraciones en color |
||
| 336 |
_aTexto _btxt _2rdacontent |
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| 337 |
_aelectrónico _bc _2rdamedia |
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| 338 |
_arecurso electrónico _bcr _2rdacarrier |
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| 490 | 0 |
_aSpringer Theses, Recognizing Outstanding Ph.D. Research _x2190-5053 |
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| 505 | 0 | _aResearch Progress in Pb-free Soldering -- Fracture Behavior of IMCs at Cu/Pb-free Solder Interface -- Tensile-compress Fatigue Behavior of Solder Joints -- Shear Creep-fatigue Behavior of Cu/Pb-free Solder Joints -- Thermal Fatigue Behavior of Sn-Ag/Cu Solder Joints -- Conclusions. | |
| 520 | 3 | _aThis thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints. | |
| 710 | 2 |
_aSpringerLink (Online service) _0Local _9106996 |
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| 942 |
_2lcc _cLE |
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| 988 | _aEBOOK, asignarmaterias , EBSPRINGER | ||
| 650 | 7 |
_9138325 _aMecánica _0comprobar BNE19900958451 _2embne |
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| 650 | 0 | 7 |
_aAnálisis estructural (Ingeniería) _0 _2embne _9150495 |
| 856 | 4 | 0 |
_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://link.springer.com/book/10.1007/978-3-662-48823-2 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid) |
| 901 | _ai9783662488232 | ||
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_a.b12957756 _b10-10-17 _c21-11-16 |
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