000			03884nam a22003855i 4500
001			84697
003			ES-MaUEC
005			20230207040436.0
007			cr nn 008mamaa
008			160511s2016 gw | s |||| 0|eng d
020			_a9783319204819
040			_aES-MaUEC
050		4	_aTK7888.4 _bD783 2016
082	0	4	_a621.3815
245	1	0	_a3D Stacked Chips : _bFrom Emerging Processes to Heterogeneous Systems _cedited by Ibrahim (Abe) M Elfadel, Gerhard Fettweis
260			_aCham _bSpringer International Publishing _c2016
300			_a1 recurso en línea (XXIII, 339 páginas) _b238 ilustraciones, 157 ilustraciones en color
336			_aTexto _btxt _2rdacontent
337			_aelectrónico _bc _2rdamedia
338			_arecurso electrónico _bcr _2rdacarrier
505	0		_aIntroduction to Electrical 3D Integration -- Copper-based TSV � Interposer -- Multi-TSV Crosstalk Channel Equalization with Non-Uniform Quantization -- Energy Efficient Electrical Intra-Chip Stack Communication -- Clock Generators for Heterogeneous MPSoCs within 3D Chip Stacks -- Energy Efficient Communications Employing 1-Bit Quantization at the Receiver -- 2-nm Laser Synthesized Si-Nanoparticles for Low Power Memory Applications -- Accurate Temperature Measurement for 3D Thermal Management -- EDA Environments for 3D Chip Stacks -- Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias -- Introduction to Optical Inter- and Intraconnects -- Optical Through-Silicon Vias -- Integrated Optical Devices for 3D Photonic Transceivers -- Cantilever Design for Tunable WDM Filters based on Silicon Microring Resonators -- Athermal photonic circuits for optical on-chip interconnects -- Integrated Circuits for 3D Photonic Transceivers -- Review of interdigitated back contacted full heterojunction solar cell (IBC-SHJ): a simulation approach.-.
520	3		_aThis book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. �The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems. � �Provides single-source reference to the latest research in 3D optoelectronic integration: process, devices, and systems; �Explains the use of wireless 3D integration to improve 3D IC reliability and yield; �Describes techniques for monitoring and mitigating thermal behavior in 3D ICs; �Includes discussion of 3D integration of high-density power sources and novel NVM.
710	2		_aSpringerLink (Online service) _0Local _9106996
942			_2lcc _cLE
988			_aEBOOK, asignarmaterias , EBSPRINGER
650		7	_aMicroprocesadores _9141164 _0comprobar BNE19900994978 _2embne
650		7	_9139610 _aCircuitos electrónicos _0comprobar BNE19900974538 _2embne
700	1		_aElfadel, Ibrahim (Abe) M. _eeditor literario _997072 _0Local
700	1		_aFettweis, Gerhard _eeditor literario _0Local _997073
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://link.springer.com/book/10.1007/978-3-319-20481-9 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
901			_ai9783319204819
907			_a.b12939754 _b10-10-17 _c21-11-16
998			_am _a_alco _a_vill _b - - _cm _dz _e- _feng _ggw _h0
945			_aTK7888.4 D783 2016 EB _g1 _ieBOOK _j0 _lmae _o- _pEUR0.00 _q- _r- _sb _t15 _u0 _v0 _w0 _x0 _y.i1158421x _z06-04-17
999			_c84697 _d84697 _x1