000			03216nam a2200337 i 4500
999			_c401675 _d401675
001			401675
003			ES-MaUEC
005			20240521102652.0
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007			cr nn 008mamaa
008			231004s2024 sz | fo |||| 0|eng d
020			_a9783030983239
024	7		_a10.1007/978-3-030-98323-9 _2doi
040			_aES-MaUEC _bspa _cES-MaUEC _dES-MaUEC
050		4	_aTA1675 _b2024 EB
245	0	0	_aTailored Light 2 : _bLaser Applications _cedited by Reinhart Poprawe, Constantin Häfner, Rolf Wester
250			_a2nd ed. 2024
264		1	_aCham _bSpringer International Publishing _c2024
300			_a1 recurso en línea
336			_atexto _btxt _2rdacontent
337			_aelectrónico _bc _2rdamedia
338			_arecurso electrónico _bcr _2rdacarrier
490	0		_aRWTHedition _x1865-0902
505	0		_aPhysical Basics -- Industrial Laser System -- Beam Shaping for Laser Treatment -- Adapted Beam Shaping Using Free-form Optics -- Laser Softening -- Transformation Hardening -- Polishing with Laser Radiation -- Laser Powder Bed Fusion -- LMD-Introduction -- LMD Fundamentals -- System Technology -- Extreme High-speed Laser Material Deposition - EHLA -- Wire Laser Metal Deposition -- Hybrid AM and Process Chains -- Applications -- Materials for Additive Manufacturing -- Additive Manufacturing of Embedded Sensors -- Laser Induced Forward Transfer - LIFT -- Stereolithography for Biofabrication -- Thin and Thick Film Processing -- Bending -- Heat Conduction Mode Welding -- Laser Beam Welding of Thermoplastics -- Laser Transmission Bonding -- Soldering -- Laserbeam Microwelding -- Hybrid Lightweight Components -- Laser-based Glass Frit Bonding -- Transparent Materials -- Thin Film Ablation -- Cleaning -- Drilling -- Fusion Cutting -- High Speed Cutting -- Sublimation Cutting -- Remote Cutting -- Laser Fine Cutting -- Process Monitoring -- Numerically Controlled Tooling Machines for Laser Materials Processing -- Optical Coherence Tomography -- Laser-induced Breakdown Spectroscopy -- Light scattering for Inline Process Monitoring -- Pulsed Plasma EUV Sources -- EUV Optics -- EUV Measurement Technologies.
520			_aThis book covers the application technology of lasers, focusing more on the vast range of processes than on individual applications, in order to motivate and enable future innovations. The physical basics are presented in the first half of the book. The following examination of application categories and their processes is documented by experts from their practical points of view but always refers back to the underlying physical principles. In this way, readers are free to choose their own individual level of depth in understanding this globally relevant field of innovation. This new edition of Tailored Light 2: Laser Applications birings the book up to date with the latest applications of laster technology. .
988			_aSpringer_Engineering_2024
650		7	_2embne _9137899 _aLáseres
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-3-030-98323-9 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
942			_2lcc _cLE
998			_b05/2024 _dz _eb _zSI