000			03091nam a22004335i 4500
999			_c387587 _d387587
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003			ES-MaUEC
005			20230326133437.0
006			a||||fo|||| 00| 0
007			cr nn 008mamaa
008			220601s2008 sz | s |||| 0|eng d
020			_a9783031025532
024	7		_a10.1007/978-3-031-02553-2 _2doi
040			_aES-MaUEC _bspa _cES-MaUEC _dES-MaUEC
050		4	_aTA1660 _b2008 EB
100	1		_aChen, Ray T. _eautor _4aut _4http://id.loc.gov/vocabulary/relators/aut _9687652
245	1	0	_aOptical Interconnects _cby Ray T. Chen, Chulchae Choi
250			_a1st edition 2008
264		1	_aCham _bSpringer International Publishing _c2008
300			_a1 recurso en línea (XI, 91 páginas)
336			_atexto _btxt _2rdacontent
337			_aelectrónico _bc _2rdamedia
338			_arecurso electrónico _bcr _2rdacarrier
347			_aarchivo de texto _bPDF
490	0		_aSynthesis Lectures on Solid State Materials and Devices _x1932-1724
505	0		_aIntroduction -- Thinned Vertical Cavity Surface Emitting Laser Fabrication -- VCSEL Characterization -- Thermal Management of Embedded VCSEL -- Optical Interconnection Layer -- System Integration -- Summary -- Effects of Thermal-Via Structures on Thin Film VCSELs for a Fully Embedded Board-Level Optical Interconnection System.
520			_aThis book describes fully embedded board level optical interconnect in detail including the fabrication of the thin-film VCSEL array, its characterization, thermal management, the fabrication of optical interconnection layer, and the integration of devices on a flexible waveguide film. All the optical components are buried within electrical PCB layers in a fully embedded board level optical interconnect. Therefore, we can save foot prints on the top real estate of the PCB and relieve packaging difficulty reduced by separating fabrication processes. To realize fully embedded board level optical interconnects, many stumbling blocks need to be addressed such as thin-film transmitter and detector, thermal management, process compatibility, reliability, cost effective fabrication process, and easy integration. The material presented eventually will relieve such concerns and make the integration of optical interconnection highly feasible. The hybrid integration of the optical interconnection layer and electrical layers is ongoing.
988			_aSynthesis Collection of Technology_2008
650		7	_2embne _9138689 _aMicroelectrónica
650		7	_2embne _9139613 _aCircuitos impresos
650		7	_2embne _9139614 _aCircuitos integrados
700	1		_aChoi, Chulchae _eautor _4aut _4http://id.loc.gov/vocabulary/relators/aut _9687653
776	0	8	_iPrinted edition: _z9783031014253
776	0	8	_iPrinted edition: _z9783031036811
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-3-031-02553-2 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
942			_2lcc _cLE
998			_b03/2023 _dz _esc _zSI