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007			cr nn 008mamaa
008			220601s2015 sz | s |||| 0|eng d
020			_a9783031017476
024	7		_a10.1007/978-3-031-01747-6 _2doi
040			_aES-MaUEC _bspa _cES-MaUEC _dES-MaUEC
050		4	_aTK7874.893 _b2015 EB
100	1		_aXie, Yuan, _eautor _4aut _4http://id.loc.gov/vocabulary/relators/aut _9686864 _d1973-
245	1	0	_aDie-stacking Architecture _cby Yuan Xie, Jishen Zhao
250			_a1st edition 2015
264		1	_aCham _bSpringer International Publishing _c2015
300			_a1 recurso en línea (XIV, 113 páginas)
336			_atexto _btxt _2rdacontent
337			_aelectrónico _bc _2rdamedia
338			_arecurso electrónico _bcr _2rdacarrier
347			_aarchivo de texto _bPDF
490	0		_aSynthesis Lectures on Computer Architecture _x1935-3243
505	0		_aPreface -- Acknowledgments -- 3D Integration Technology -- Benefits of 3D Integration -- Fine-granularity 3D Processor Design -- Coarse-granularity 3D Processor Design -- 3D GPU Architecture -- 3D Network-on-Chip -- Thermal Analysis and Thermal-aware Design -- Cost Analysis for 3D ICs -- Conclusion -- Bibliography .
520			_aThe emerging three-dimensional (3D) chip architectures, with their intrinsic capability of reducing the wire length, promise attractive solutions to reduce the delay of interconnects in future microprocessors. 3D memory stacking enables much higher memory bandwidth for future chip-multiprocessor design, mitigating the "memory wall" problem. In addition, heterogenous integration enabled by 3D technology can also result in innovative designs for future microprocessors. This book first provides a brief introduction to this emerging technology, and then presents a variety of approaches to designing future 3D microprocessor systems, by leveraging the benefits of low latency, high bandwidth, and heterogeneous integration capability which are offered by 3D technology.
988			_aSynthesis Collection of Technology_2015
650		7	_2embne _9139614 _aCircuitos integrados
650		7	_2embne _9144554 _aArquitectura de ordenador
700	1		_aZhao, Jishen _eautor _4aut _4http://id.loc.gov/vocabulary/relators/aut _9686865 _c(Computer engineer)
776	0	8	_iPrinted edition: _z9783031006197
776	0	8	_iPrinted edition: _z9783031028755
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-3-031-01747-6 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
942			_2lcc _cLE
998			_b02/2023 _dz _esc _zSI