000			03029nam a2200421 i 4500
999			_c386950 _d386950
001			386950
003			ES-MaUEC
005			20230125182155.0
006			a||||fo|||| 00| 0
007			cr nn 008mamaa
008			220601s2008 sz | o |||| 0|eng d
020			_a9783031017032
024	7		_a10.1007/978-3-031-01703-2 _2doi
040			_aES-MaUEC _bspa _cES-MaUEC _dES-MaUEC
050		4	_aTK7870.15 _b2008 EB
100	1		_aLee, Jong-Hoon _eautor _4aut _4http://id.loc.gov/vocabulary/relators/aut
245	1	0	_aThree-Dimensional Integration and Modeling _bA Revolution in RF and Wireless Packaging _cby Jong-Hoon Lee, Manos Tentzeris.
250			_a1st edition 2008
264		1	_aCham _bSpringer International Publishing _c2008
300			_a1 recurso en línea (X, 108 páginas)
336			_atexto _btxt _2rdacontent
337			_aelectrónico _bc _2rdamedia
338			_arecurso electrónico _bcr _2rdacarrier
347			_aarchivo de texto _bPDF
490	0		_aSynthesis Lectures on Computational Electromagnetics _x1932-1716
505	0		_aIntroduction -- Background on Technologies for Millimeter-Wave Passive Front-Ends -- Three-Dimensional Packaging in Multilayer Organic Substrates -- Microstrip-Type Integrated Passives -- Cavity-Type Integrated Passives -- Three-Dimensional Antenna Architectures -- Fully Integrated Three-Dimensional Passive Front-Ends -- References.
520			_aThis book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization. Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules. Table of Contents: Introduction / Background on Technologies for Millimeter-Wave Passive Front-Ends / Three-Dimensional Packaging in Multilayer Organic Substrates / Microstrip-Type Integrated Passives / Cavity-Type Integrated Passives / Three-Dimensional Antenna Architectures / Fully Integrated Three-Dimensional Passive Front-Ends / References.
988			_aSynthesis Collection of Technology_2008
650		7	_2embne _9153705 _aComponentes electrónicos
650		7	_2embne _9158044 _aSistemas de comunicación inalámbricos
700	1		_aTentzeris, Manos M. _eautor _4aut _4http://id.loc.gov/vocabulary/relators/aut _9686223
776	0	8	_iPrinted edition: _z9783031005756
776	0	8	_iPrinted edition: _z9783031028311
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-3-031-01703-2 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
942			_2lcc _cLE
998			_b01/2023 _dz _eb _zSI