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020 _a9783030801359
024 7 _a10.1007/978-3-030-80135-9
_2doi
040 _bspa
_cES-MaUEC
_dES-MaUEC
050 4 _aTK7871.85
_b2022 EB
245 0 0 _aSilicon Sensors and Actuators :
_bThe Feynman Roadmap
_cedited by Benedetto Vigna, Paolo Ferrari, Flavio Francesco Villa, Ernesto Lasalandra, Sarah Zerbini
250 _a1st edition 2022
264 1 _aCham
_bSpringer International Publishing
_c2022
300 _a1 recurso en línea (XIII, 997 páginas)
_b884 ilustraciones, 623 ilustraciones a color
336 _atexto
_btxt
_2rdacontent
337 _aelectrónico
_bc
_2rdamedia
338 _arecurso electrónico
_bcr
_2rdacarrier
347 _aarchivo de texto
_bPDF
505 0 _a1. Silicon as Sensor Material -- 2. Epitaxial Growth -- 3. Thin Film Deposition -- 4. Thin Films Characterization & Metrology -- 5. Dry silicon etch -- 6. Lithography -- 7. HF Release -- 8. Galvanic growth -- 9. Wet Etch and Cleaning -- 10. Piezoelectric materials -- 11. Wafer to wafer Bonding.-12. Linear and non linear mechanichs in MEMS -- 13. Inertial sensors -- 14. Magnetometer -- 15. MEMS microphones -- 16. Pressure Sensors -- 17. Enviromental Sensors -- 18. Mirror -- 19. Piezo ink jet printers -- 20. Speakers -- 21. Autofocus -- 22. Electronic sensors front-end -- 23. Electronic Interfaces for actuators -- 24. Package -- 25. Testing -- 26. Reliability -- 27. The future of sensor and actuators.
520 _aThis book thoroughly reviews the present knowledge on silicon micromechanical transducers and addresses emerging and future technology challenges. Readers will acquire a solid theoretical and practical background that will allow them to analyze the key performance aspects of devices, critically judge a fabrication process, and then conceive and design new ones for future applications. Envisioning a future complex versatile microsystem, the authors take inspiration from Richard Feynman's visionary talk "There is Plenty of Room at the Bottom" to propose that the time has come to see silicon sensors as part of a "Feynman Roadmap" instead of the "More-than-Moore" technology roadmap. The sharing of the author's industrially proven track record of development, design, and manufacturing, along with their visionary approach to the technology, will allow readers to jump ahead in their understanding of the core of the topic in a very effective way. Students, researchers, engineers, and technologists involved in silicon-based sensor and actuator research and development will find a wealth of useful and groundbreaking information in this book.
988 _aSpringer_Engineering_2022
650 7 _2embne
_9140004
_aSemiconductores
650 7 _2embne
_9139226
_aCircuitos eléctricos
700 1 _aVigna, Benedetto
_eeditor literario
_4edt
_4http://id.loc.gov/vocabulary/relators/edt
700 1 _aFerrari, Paolo
_eeditor literario
_4edt
_4http://id.loc.gov/vocabulary/relators/edt
700 1 _aVilla, Flavio Francesco
_eeditor literario
_4edt
_4http://id.loc.gov/vocabulary/relators/edt
700 1 _aLasalandra, Ernesto
_eeditor literario
_4edt
_4http://id.loc.gov/vocabulary/relators/edt
700 1 _aZerbini, Sarah
_eeditor literario
_4edt
_4http://id.loc.gov/vocabulary/relators/edt
776 0 8 _iPrinted edition:
_z9783030801342
776 0 8 _iPrinted edition:
_z9783030801366
776 0 8 _iPrinted edition:
_z9783030801373
856 4 0 _uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-3-030-80135-9
_zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
942 _2lcc
_cLE
998 _b12/2022
_dz
_eb
_zSI