000			03736nam a2200433 i 4500
999			_c384151 _d384151
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008			220408s2022 si a o |||| 0|eng d
020			_a9789811698248
024	7		_a10.1007/978-981-16-9824-8 _2doi
040			_bspa _cES-MaUEC _dES-MaUEC
050		4	_aTK7870 _b2022 EB
100	1		_aKuttiyil Thomas, Oommen Tharakan _eautor _4aut _4http://id.loc.gov/vocabulary/relators/aut _9685665
245	1	0	_aElectronics Production Defects and Analysis _cby Oommen Tharakan Kuttiyil Thomas, Padma Padmanabhan Gopalan
250			_a1st edition 2022
264		1	_aSingapore _bSpringer International Publishing _c2022
300			_a1 recurso en línea (XXI, 140 páginas) _b250 ilustraciones, 248 ilustraciones a color
336			_atexto _btxt _2rdacontent
337			_aelectrónico _bc _2rdamedia
338			_arecurso electrónico _bcr _2rdacarrier
347			_aarchivo de texto _bPDF
490	0		_aSpringer Tracts in Electrical and Electronics Engineering _x2731-4219
505	0		_aChapter 1: Introduction -- Chapter 2: Soldering Defects -- Chapter 3: PCB Defects -- Chapter 4: Mounting Defects -- Chapter 5: Conformal Coating and Potting Defects -- Chapter 6: EEE Component Defects -- Chapter 7: Workmanship Defects -- Chapter 8: Defects due to the usage of Non-FFF Components -- Chapter 9: Defects in CAD Layout.
520			_aThis book is a unique book capturing defects that are frequently encountered during various fabrication phases of electronic packages. These defects have been analyzed to their root cause and mitigation techniques and presented in the book. The book includes 228 cases with more than 480 color and magnified images of the defects. These defects are covered under eight subheads, viz soldering defects, PCB defects, mounting defects, conformal coating and potting defects, EEE component defects, workmanship defects, defects due to usage of non-FFF components, and defects in CAD layout. The possible reasons for the occurrence of the defects and the methods/practices by which they can be eliminated/mitigated have also been discussed. The chapter "mounting defects" shows the correct approach in the adjacent photograph, so that the users can refer to the right procedures. The book is helpful to those who are involved in the production of electronics packages to familiarize them with the different cases shown carefully and revised frequently. Exposure to the different defects is useful to all who are working in fabrication and quality control to realize a zero-defect product sans much time and investment. The book is valuable for the technical community working for aerospace applications, industry partners in the realization of space programs, aerospace, and high-reliability institutions, various electronic fabrication agencies in the country, engineers and technicians taking up courses in high-reliability soldering and fabrication techniques, and the students.
988			_aSpringer_Engineering_2022
650		7	_2embne _9153705 _aComponentes electrónicos
700	1		_aGopalan, Padma Padmanabhan _d1962- _eautor _4aut _4http://id.loc.gov/vocabulary/relators/aut _9685666
776	0	8	_iPrinted edition: _z9789811698231
776	0	8	_iPrinted edition: _z9789811698255
776	0	8	_iPrinted edition: _z9789811698262
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-981-16-9824-8 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
942			_2lcc _cLE
998			_b12/2022 _dz _eb _zSI