000			03132nam a2200433 i 4500
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008			220318s2022 sz a o |||| 0|eng d
020			_a9783030977269
024	7		_a10.1007/978-3-030-97726-9 _2doi
040			_bspa _cES-MaUEC _dES-MaUEC
050		4	_aTK7870 _b2022 EB
100	1		_aElsobky, Mourad _eautor _4aut _4http://id.loc.gov/vocabulary/relators/aut _9685482
245	1	0	_aUltra-Thin Sensors and Data Conversion Techniques for Hybrid System-in-Foil _cby Mourad Elsobky
250			_a1st edition 2022
264		1	_aCham _bSpringer International Publishing _c2022
300			_a1 recurso en línea (XXI, 139 páginas) _b82 ilustraciones, 77 ilustraciones a color
336			_atexto _btxt _2rdacontent
337			_aelectrónico _bc _2rdamedia
338			_arecurso electrónico _bcr _2rdacarrier
347			_aarchivo de texto _bPDF
490	0		_aSpringer Theses Recognizing Outstanding Ph.D. Research _x2190-5061
505	0		_aMotivation -- Introduction to Hybrid System-in-Foil -- O-Chip/On-Foil Passive and Active Components.
520			_aThis book reports on the design, fabrication and characterization of a set of flexible electronic components, including on-foil sensors, organic thin-film transistors and ultra-thin chips. The core of the work is on showing how to combine high-performance integrated circuits with large-area electronic components on a single polymeric foil, to realize smart electronic systems for different applications, such as temperature, humidity and mechanical stress sensors. The book offers an extensive introduction to Hybrid System-in-Foil technology (HySiF), and related on-chip/on-foil passive and active components. It presents six case studies designed to highlight key HySiF challenges, together with the methodology to address those challenges. Last but not least, it describes the development of a reconfigurable, energy-efficient Analog-to-Digital Converter for HySiF. All in all, this book provides readers with extensive information on the state of the art in the design and characterization of integrated circuits and hybrid electronic systems on flexible polymeric substrates. By describing significant advances in organic thin-film transistor technology, this work is expected to pave the way to future developments in the area of energy-efficient smart sensors and integrated circuits.
988			_aSpringer_Engineering_2022
650		7	_2embne _9138690 _aElectrónica _xMaterial y equipo
650		7	_2embne _9153705 _aComponentes electrónicos
776	0	8	_iPrinted edition: _z9783030977252
776	0	8	_iPrinted edition: _z9783030977276
776	0	8	_iPrinted edition: _z9783030977283
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-3-030-97726-9 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
942			_2lcc _cLE
998			_b11/2022 _dz _eb _zSI