000 03947nam a22004455i 4500
999 _c362085
_d362085
_x1
001 362085
003 ES-MaUEC
005 20230102121503.0
006 a||||fo|||| 00| 0
007 cr nn 008mamaa
008 220226s2021 gw | s |||| 0|eng d
020 _a9783030734459
024 7 _a10.1007/978-3-030-73445-9
_2doi
040 _aES-MaUEC
_bspa
_cES-MaUEC
_dES-MaUEC
050 4 _aTK7874
_b2021 EB
100 1 _aVemuri, Ranga
_eautor
_4
_4http://id.loc.gov/vocabulary/relators/aut
_9682501
245 1 0 _aSplit Manufacturing of Integrated Circuits for Hardware Security and Trust :
_bMethods, Attacks and Defenses
_cby Ranga Vemuri, Suyuan Chen
250 _aFirst edition 2021
264 1 _aCham
_bSpringer International Publishing
_c2021
300 _a1 recurso en línea (XXIX, 193 páginas)
_b 55 ilustraciones, 47 ilustraciones a color
336 _2rdacontent
_aTexto
_btxt
337 _2rdamedia
_aelectrónico
_bc
338 _2rdacarrier
_arecurso electrónico
_bcr
347 _aarchivo de texto
_bPDF
490 0 _aEngineering (SpringerNature-11647)
490 0 _aEngineering (R0) (SpringerNature-43712)
505 0 _aIntroduction -- Split Manufacturing Methods -- Design Constraint Based Attacks -- Defenses Against Design Constraint Based Attacks -- Satisfiability Based Attacks -- Defenses Against Satisfiability Based Attacks -- Emerging Directions. .
520 3 _aGlobalization of the integrated circuit (IC) supply chains led to many potential vulnerabilities. Several attack scenarios can exploit these vulnerabilities to reverse engineer IC designs or to insert malicious trojan circuits. Split manufacturing refers to the process of splitting an IC design into multiple parts and fabricating these parts at two or more foundries such that the design is secure even when some or all of those foundries are potentially untrusted. Realizing its security benefits, researchers have proposed split fabrication methods for 2D, 2.5D, and the emerging 3D ICs. Both attack methods against split designs and defense techniques to thwart those attacks while minimizing overheads have steadily progressed over the past decade. This book presents a comprehensive review of the state-of-the-art and emerging directions in design splitting for secure split fabrication, design recognition and recovery attacks against split designs, and design techniques to defend against those attacks. Readers will learn methodologies for secure and trusted IC design and fabrication using split design methods to protect against supply chain vulnerabilities. Provides the first book on Split Manufacturing methods, attacks and defenses for integrated circuits; Serves as single-source reference to all advances to-date on split manufacturing methods and design splitting techniques for 2D, 2.5D and 3D integrated circuits, design recovery attacks and defense methods; Covers design constraint based attacks and satisfiability based attacks to reverse engineer split designs or to insert hardware trojans; Covers design-for-trust defense techniques to thwart both reverse engineering and trojan insertion attacks; Discusses the security benefits and cost penalties of various split design methods; Includes challenges and emerging research directions.
988 _aSpringer_Engineering_2021
650 7 _2embne
_9139614
_aCircuitos integrados
650 7 _2embne
_9163432
_aProcesos de fabricación
650 7 _2embne
_aLogística empresarial
_9152904
700 1 _aChen, Suyuan
_eautor
_4
_4http://id.loc.gov/vocabulary/relators/aut
_9682502
776 0 8 _iPrinted edition:
_z9783030734442
776 0 8 _iPrinted edition:
_z9783030734466
776 0 8 _iPrinted edition:
_z9783030734473
856 4 0 _uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-3-030-73445-9
_zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
942 _2lcc
_cLE
998 _b02/2022
_dz
_eIG
_zSI