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| 003 | ES-MaUEC | ||
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| 008 | 220212s2021 si | s |||| 0|eng d | ||
| 020 | _a9789811613760 | ||
| 024 | 7 |
_a10.1007/978-981-16-1376-0 _2doi |
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| 040 |
_aES-MaUEC _bspa _cES-MaUEC _dES-MaUEC |
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| 050 | 4 |
_aTK7871.85 _b2021 EB |
|
| 100 | 1 |
_aLau, John H. _eautor _4 _4http://id.loc.gov/vocabulary/relators/aut _9673189 |
|
| 245 | 1 | 0 |
_aSemiconductor Advanced Packaging _cby John H. Lau |
| 250 | _aFirst edition 2021 | ||
| 264 | 1 |
_aSingapore _bSpringer International Publishing _c2021 |
|
| 300 |
_a1 recurso en línea (XXII, 498 páginas) _b 557 ilustraciones, 530 ilustraciones a color |
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| 336 |
_2rdacontent _aTexto _btxt |
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| 337 |
_2rdamedia _aelectrónico _bc |
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| 338 |
_2rdacarrier _arecurso electrónico _bcr |
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| 347 |
_aarchivo de texto _bPDF |
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| 490 | 0 | _aEngineering (SpringerNature-11647) | |
| 490 | 0 | _aEngineering (R0) (SpringerNature-43712) | |
| 505 | 0 | _aRecent Advance on Semiconductor Packaging -- System-in-Package -- Fan-In Wafer/Panel-Level Chip-Scale Packages -- Fan-Out Wafer/Panel-Level Packaging -- 2D, 2.1D, and 2.3D IC Integration -- 2.5D IC Integration -- 3D IC Integration -- Hybrid Bonding -- Chiplets Packaging -- Dielectric Materials -- Trends and Roadmap for Advanced Semiconductor Packaging. | |
| 520 | 3 | _aThe book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc. | |
| 988 | _aSpringer_Engineering_2021 | ||
| 650 | 7 |
_2embne _9140004 _aSemiconductores |
|
| 776 | 0 | 8 |
_iPrinted edition: _z9789811613753 |
| 776 | 0 | 8 |
_iPrinted edition: _z9789811613777 |
| 776 | 0 | 8 |
_iPrinted edition: _z9789811613784 |
| 856 | 4 | 0 |
_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-981-16-1376-0 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid) |
| 942 |
_2lcc _cLE |
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| 998 |
_b02/2022 _dz _eIG _zSI |
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