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999			_c120417 _d120417
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008			200529s2020 si a o |||| 0|eng d
020			_a9789811539206
024	7		_a10.1007/978-981-15-3920-6 _2doi
040			_aES-MaUEC _bspa _cES-MaUEC _dES-MaUEC
050		4	_aTS227 _b2020 EB
100	1		_aLau, John H. _eautor _4aut _4http://id.loc.gov/vocabulary/relators/aut _1http://viaf.org/viaf/49378960 _9673189
245	1	0	_aAssembly and Reliability of Lead-Free Solder Joints _cby John H Lau, Ning-Cheng Lee
250			_aFirst edition
264		1	_aSingapore _bSpringer Singapore : _bImprint: Springer _c2020
300			_a1 recurso en línea (XXI, 527 páginas) _b598 ilustraciones, 347 ilustraciones a color
336			_2rdacontent _aTexto _btxt
337			_2rdamedia _aelectrónico _bc
338			_2rdacarrier _arecurso electrónico _bcr
347			_aArchivo de texto _bPDF
490	0		_aEngineering (Springer-11647)
505	0		_aSolder Joints in Printed Circuit Board Assembly -- Solder Joints in Advanced Packaging -- Prevailing Lead-Free Materials -- Soldering Processes -- Advanced Specialty Flux Design -- Solder Joint Characterization -- Reliability Tests and Data Analyses of Solder Joints -- Design for Reliability and Failure Analysis of Solder Joints.
520	3		_aThis book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.
988			_aSpringer_Engineering_23062020
650		7	_2embne _9140220 _aSoldadura
700	1		_aLee, Ning-Cheng _eautor _4aut _4http://id.loc.gov/vocabulary/relators/aut _0http://id.loc.gov/authorities/names/n2001005642 _1http://viaf.org/viaf/240375321 _9674503
710	2		_aSpringerLink (Online service) _0http://id.loc.gov/authorities/names/no2005046756 _1http://viaf.org/viaf/148105729
776	0	8	_iPrinted edition: _z9789811539190
776	0	8	_iPrinted edition: _z9789811539213
776	0	8	_iPrinted edition: _z9789811539220
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-981-15-3920-6 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
942			_2lcc _cLE
998			_b06/2020 _dz _eIG _zSI