| 000 | 03337nam a22004215i 4500 | ||
|---|---|---|---|
| 999 |
_c120336 _d120336 |
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| 001 | 120336 | ||
| 003 | ES-MaUEC | ||
| 005 | 20230102114036.0 | ||
| 006 | a||||fo|||| 00| 0 | ||
| 007 | cr nn nnnaamaa | ||
| 008 | 200409s2020 gw a o |||| 0|eng d | ||
| 020 | _a9783030405601 | ||
| 024 | 7 |
_a10.1007/978-3-030-40560-1 _2doi |
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| 040 |
_aES-MaUEC _bspa _cES-MaUEC _dES-MaUEC |
||
| 050 | 4 |
_aTK7875 _b2020 EB |
|
| 100 | 1 |
_aHuff, Michael N. _eautor _4aut _4http://id.loc.gov/vocabulary/relators/aut _1http://viaf.org/viaf/622149106386368492811 _9675170 |
|
| 245 | 1 | 0 |
_aProcess Variations in Microsystems Manufacturing / _cMichael Huff |
| 250 | _aFirst edition | ||
| 264 | 1 |
_aCham _bSpringer International Publishing : _bImprint: Springer _c2020 |
|
| 300 |
_a1 recurso en línea (XIX, 521 páginas) _b236 ilustraciones, 24 ilustraciones a color |
||
| 336 |
_2rdacontent _aTexto _btxt |
||
| 337 |
_2rdamedia _aelectrónico _bc |
||
| 338 |
_2rdacarrier _arecurso electrónico _bcr |
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| 347 |
_aArchivo de texto _bPDF |
||
| 490 | 0 |
_aMicrosystems and Nanosystems _x2198-0063 |
|
| 490 | 0 | _aEngineering (Springer-11647) | |
| 505 | 0 | _aIntroduction -- Overview of Microsystems Manufacturing -- Process Variations in Microsystems Processing Steps -- Microsystems Metrology Methods and Associated Errors -- Process Integration and Variations in Material Properties -- Device Parameter Variations in Microsystems Manufacturing -- Quality Assurance and Control Methods Used in Microsystems Manufacturing -- Design Methods for Handling Process Variations -- Future Methods for Improved Microsystems Manufacturing Process Variations. | |
| 520 | 3 | _aThis book thoroughly examines and explains the basic processing steps used in MEMS fabrication (both integrated circuit and specialized micro machining processing steps. The book places an emphasis on the process variations in the device dimensions resulting from these commonly used processing steps. This will be followed by coverage of commonly used metrology methods, process integration and variations in material properties, device parameter variations, quality assurance and control methods, and design methods for handling process variations. A detailed analysis of future methods for improved microsystems manufacturing is also included. This book is a valuable resource for practitioners, researchers and engineers working in the field as well as students at either the undergraduate or graduate level. Examines and explains the basic processing steps used in MEMS fabrication; Illustrates best practices and lessons learned in manufacturing of microsystems for commercial products with detailed case studies; Reviews future methods that may provide for improved process variations. | |
| 988 | _aSpringer_Engineering_23062020 | ||
| 650 | 7 |
_aNanotecnología _2embne _9158453 |
|
| 650 | 7 |
_aMicroelectrónica _2embne _9138689 |
|
| 710 | 2 |
_aSpringerLink (Online service) _0http://id.loc.gov/authorities/names/no2005046756 _1http://viaf.org/viaf/148105729 |
|
| 776 | 0 | 8 |
_iPrinted edition: _z9783030405588 |
| 776 | 0 | 8 |
_iPrinted edition: _z9783030405595 |
| 856 | 4 | 0 |
_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-3-030-40560-1 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid) |
| 942 |
_2lcc _cLE |
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| 998 |
_b07/2020 _dz _eo _zSI |
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