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008			191203s2020 si a o |||| 0|eng d
020			_a9789811501739
024	7		_a10.1007/978-981-15-0173-9 _2doi
040			_aES-MaUEC _bspa _cES-MaUEC _dES-MaUEC
050		4	_aTK153 _b2020 EB
245	0	0	_aModeling and Application of Electromagnetic and Thermal Field in Electrical Engineering _cedited by Zhiguang Cheng, Norio Takahashi, Behzad Forghani
250			_aPrimera edición 2020
264		1	_aSingapore _bSpringer _c2020
300			_a1 recurso en línea (XXX, 685 páginas) _b 623 ilustraciones, 232 ilustraciones a color
336			_2rdacontent _aTexto _btxt
337			_2rdamedia _aelectrónico _bc
338			_2rdacarrier _arecurso electrónico _bcr
347			_atext file _bPDF
490	0		_aEngineering (Springer-11647)
505	0		_aGeneral Survey -- Low Frequency Electromagnetic Fields and the Finite Element Method -- Some Key Techniques in Electromagnetic and Thermal Field Modeling -- Solution of Coupled Electromagnetic-Thermal Fields -- Development of the API-based Script -- Harmonic-Balance Finite-Element Method and Its Application -- Magnetic Material Modeling -- Measurements of Multi-Directional Anisotropy Using Epstein Frame -- Electromagnetic Properties Modeling Based on Laminated Core Models -- Electromagnetic Properties Modeling Based on Ring Type Core Models -- Magnetic Properties Measurement under Extreme Excitation Conditions -- Problem 21 Benchmark Family and Stray-Field Loss Problems -- Additional Loss caused by the Magnetic Flux Normal to the Plane of Laminations -- Electromagnetic and Thermal Modeling based on Transformer Model -- Modeling DC Bias in Transformers.
520	3		_aCo-authored by an international research group with a long-standing cooperation, this book focuses on engineering-oriented electromagnetic and thermal field modeling and application. It presents important contributions, including advanced and efficient finite element analysis used in the solution of electromagnetic and thermal field problems for large and multi-scale engineering applications involving application script development; magnetic measurement of both magnetic materials and components under various, even extreme conditions, based on well-established (standard and non-standard) experimental systems; and multi-level validation based on both industrial test systems and extended TEAM P21 benchmarking platform. Although these are challenging topics, they are useful for readers from both academia and industry.
988			_aPrimersemestre_2020_Engineering
650		7	_2embne _9138109 _aElectrotecnia
700	1		_aCheng, Zhiguang _eeditor
700	1		_aTakahashi, Norio _eeditor
700	1		_aForghani, Behzad _eeditor
773	0		_tSpringer eBooks
776	0	8	_iPrinted edition: _z9789811501722
776	0	8	_iPrinted edition: _z9789811501746
776	0	8	_iPrinted edition: _z9789811501753
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-981-15-0173-9 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
942			_2lcc _cLE _n0
998			_b03/2020 _dz _eu _zSI