000			03099nam a22004335i 4500
988			_aSpringer_Engineering_2020
999			_c116874 _d116874 _x1
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003			ES-MaUEC
005			20230104140222.0
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007			cr nn nnnaamaa
008			190708s2020 gw | s |||| 0|eng d
020			_a9783030207762
024	7		_a10.1007/978-3-030-20776-2 _2doi
040			_aES-MaUEC _bspa _cES-MaUEC _dES-MaUEC
050		4	_aTJ265 _b2020 EB
100	1		_aSaha, Sujoy Kumar _eautor _4aut _4http://id.loc.gov/vocabulary/relators/aut _997048
245	1	0	_aInsert Devices and Integral Roughness in Heat Transfer Enhancement _cby Sujoy Kumar Saha, Hrishiraj Ranjan, Madhu Sruthi Emani, Anand Kumar Bharti.
250			_a1st ed. 2020.
264		1	_aCham _bSpringer International Publishing _c2020.
300			_a1 recurso en línea (IX, 177 páginas) _b194 ilustraciones, 99 ilustraciones a color
336			_2rdacontent _aTexto _btxt
337			_2rdamedia _aelectrónico _bc
338			_2rdacarrier _arecurso electrónico _bcr
347			_atext file _bPDF
490	0		_aSpringerBriefs in Thermal Engineering and Applied Science _x2193-2530
490	0		_aEngineering (Springer-11647)
505	0		_aChapter 1. Introduction -- Chapter 2. Twisted-Tape Insert -- Chapter 3. Displaced Enhancement Devices and Wire Coil Inserts -- Chapter 4. Swirl Generators, Extended Surface Insert and Tangential Injection Devices -- Chapter 5. Numerical Simulation of Integral Roughness, Laminar Flow in Tubes with Roughness -- Chapter 6. 2D Roughness, 3D roughness and Roughness Applications -- Chapter 7. Compound Techniques -- Chapter 8. Conclusions.
520			_aThis Brief describes heat transfer and pressure drop in heat transfer enhancement by insert devices and integral roughness. The authors deal with twisted-tape insert laminar and turbulent flow in tubes and annuli in smooth tubes and rough tubes, segmented twisted-tape inserts, displaced enhancement devices, wire coil inserts, extended surface inserts and tangential injection devices. The articles also address transverse and helical integral rib roughness, corrugated tube roughness, 3D and 2D roughness, rod bundles, outside roughness for cross flow, non-circular channels, Reynolds analogy and similarity law, numerical simulation and predictive models. The book is ideal for professionals and researchers working with thermal management in devices. .
650		7	_2embne _9139804 _aTermodinámica
700	1		_aRanjan, Hrishiraj _eautor _4aut _4http://id.loc.gov/vocabulary/relators/aut
700	1		_aEmani, Madhu Sruthi _eautor _4aut _4http://id.loc.gov/vocabulary/relators/aut
700	1		_aBharti, Anand Kumar _eautor _4aut _4http://id.loc.gov/vocabulary/relators/aut
776	0	8	_iPrinted edition: _z9783030207755
776	0	8	_iPrinted edition: _z9783030207779
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-3-030-20776-2 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
942			_2lcc _cLE
998			_aSI _cm _dz _feng _ggw _h0 _b01/2020 _eIG _zSI