000 04405nam a22004335c 4500
988 _aSpringer_Robotics_2020
999 _c115388
_d115388
_x1
001 115388
003 ES-MaUEC
005 20230110040232.0
006 a||||fo|||| 00| 0
007 cr nn nnnaamaa
008 190822s2020 gw a o |||| 0|eng d
020 _a9783030264284
024 7 _a10.1007/978-3-030-26428-4
_2doi
040 _aES-MaUEC
_bspa
_cES-MaUEC
_dES-MaUEC
050 4 _aQA76.758
_b2020 EB
245 0 0 _aSoftware engineering, artificial intelligence, networking and parallel/distributed computing
_cedited by Roger Lee
250 _aFirst edition
264 1 _aCham
_bSpringer International Publishing
_c2020
300 _a1 recurso en línea (XIII, 262 páginas)
_b88 ilustraciones, 60 ilustraciones a color
336 _2rdacontent
_aTexto
_btxt
337 _2rdamedia
_aelectrónico
_bc
338 _2rdacarrier
_arecurso electrónico
_bcr
347 _atext file
_bPDF
490 0 _aStudies in Computational Intelligence
_x1860-949X
_v850
490 0 _aIntelligent Technologies and Robotics (Springer-42732)
505 0 _aGenerating Linear Temporal Logics based on Property Specification Templates -- Rule-Based BCG Matrix for Product Portfolio Analysis -- New Cost-Consequence FMEA Model for Information Risk Management of Safe and Secure SCADA Systems -- A Dynamic Privacy Preserving Authentication Protocol In VANET Using Social Network -- A Negotiation Strategy based on Compromising Degree -- Software Developer Performance Measurement Based on Code Smells in Distributed Version Control System -- Decision Support System for Choosing an Elective Course Using Naive Bayes Classifier -- Multilevel Video Access Control Mechanism Using Low Power Based Audio Watermarking -- A Study of Persona Research on Domestic Music Applications -- Analysis of Large-Scale Diabetic Retinopathy Datasets using Texture and Blood Vessel Features -- Combination of 1D CNN and 2D CNN to evaluate the attractiveness of Display Image Advertisement and CTR Prediction -- Functional Reactive EDSL with Asynchronous Execution for Resource-Constrained Embedded Systems -- Adaptive Midpoint Relay Selection: Enhancing Throughput in D2D Communications -- Collaborative SCM System for Sustainability in the Manufacturing Supply Chain -- A Study on the Effect of Cultural Capital on the Innovative Behavior -- Evaluation of Technology Transfer Performance in Technology-Based Firms.
520 3 _aThis book presents the outcomes of the 20th IEEE/ACIS International Conference on Software Engineering, Artificial Intelligence, Networking and Parallel/Distributed Computing (SNPD 2019), which was held on July 8-10, 2019, in Toyama, Japan. The aim of the conference was to bring together researchers and scientists, businesspeople and entrepreneurs, teachers, engineers, computer users, and students to discuss the various fields of computer science and to share their experiences and exchange new ideas and information in a meaningful way. Further, they presented research results on all aspects (theory, applications and tools) of computer and information science, and discussed the practical challenges encountered in their work and the solutions they adopted to overcome them. The book highlights the best papers from those accepted for presentation at the conference. They were chosen based on review scores submitted by members of the program committee and underwent further rigorous rounds of review. From this second round, 15 of the conference's most promising papers were selected for this Springer (SCI) book and not the conference proceedings. We eagerly await the important contributions that we know these authors will make to the field of computer and information science. .
650 7 _2embne
_aIngeniería del software
_9152630
650 7 _2embne
_aProceso paralelo (Informática)
_9158747
650 7 _2embne
_aRedes informáticas
_9141354
700 1 _aLee, Roger
_eeditor
_4edt
_4http://id.loc.gov/vocabulary/relators/edt
_936024
776 0 8 _iPrinted edition:
_z9783030264277
776 0 8 _iPrinted edition:
_z9783030264291
776 0 8 _iPrinted edition:
_z9783030264307
856 4 0 _uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-3-030-26428-4
_zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
942 _2lcc
_cLE
998 _aSI
_cm
_dz
_feng
_ggw
_h0
_b12/2019
_eel
_zSI