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988 _aSpringer_Engineering_2020
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020 _a9783030150853
024 7 _a10.1007/978-3-030-15085-3
_2doi
040 _aES-MaUEC
_bspa
_cES-MaUEC
_dES-MaUEC
050 4 _aTK7874
_b2020 EB
100 1 _aEl-Kareh, Badih
_eautor
_9671583
245 1 0 _aSilicon Analog Components :
_bDevice Design, Process Integration, Characterization, and Reliability
_cby Badih El-Kareh, Lou N. Hutter.
250 _a2nd ed. 2020.
264 1 _aCham
_bSpringer International Publishing
_c2020
300 _a1 recurso en línea (XLIX, 648 páginas)
_b 473 ilustraciones, 272 ilustraciones a color
336 _2rdacontent
_aTexto
_btxt
337 _2rdamedia
_aelectrónico
_bc
338 _2rdacarrier
_arecurso electrónico
_bcr
347 _atext file
_bPDF
490 0 _aEngineering (Springer-11647)
505 0 _aThe World Is Analog -- Review of Single-Crystal Silicon Properties -- PN Junctions -- Rectifying and Ohmic Contacts -- Bipolar and Junction Field-Effect Transistors -- Analog/RF CMOS -- High-Voltage and Power Transistors -- Passive Components -- Process Integration -- Mismatch and Noise -- Chip Reliability.
520 3 _aThis book covers modern analog components, their characteristics, and interactions with process parameters. It serves as a comprehensive guide, addressing both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. Based on the authors' extensive experience in the development of analog devices, this book is intended for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science. Enables engineers to understand analog device physics, and discusses important relations between process integration, device design, component characteristics, and reliability; Describes in step-by-step fashion the components that are used in analog designs, the particular characteristics of analog components, while comparing them to digital applications; Explains the second-order effects in analog devices, and trade-offs between these effects when designing components and developing an integrated process for their manufacturing.
650 7 _2embne
_aCircuitos integrados
_9139614
700 1 _aHutter, Lou N.
_eautor
_4aut
_4http://id.loc.gov/vocabulary/relators/aut
776 0 8 _iPrinted edition:
_z9783030150846
776 0 8 _iPrinted edition:
_z9783030150860
776 0 8 _iPrinted edition:
_z9783030150877
856 4 0 _uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-3-030-15085-3
_zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
998 _aSI
_cm
_dz
_feng
_ggw
_h0
_b12/2019
_ek
_zSI