000			03647nam a2200433 c 4500
942			_2lcc _cLE
988			_aSpringer_Engineering_2020
999			_c114475 _d114475 _x1
001			114475
003			ES-MaUEC
005			20230110040223.0
006			a||||fo|||| 00| 0
007			cr nn nnnaamaa
008			190903s2020 gw a o |||| 0|eng d
020			_a9783030252014
024	7		_a10.1007/978-3-030-25201-4 _2doi
040			_aES-MaUEC _bspa _cES-MaUEC _dES-MaUEC
050		4	_aTA418.54 _b2020 EB
100	1		_aChen, Zengtao _9671560
245	1	0	_aAdvanced Thermal Stress Analysis of Smart Materials and Structures _cby Zengtao Chen, Abdolhamid Akbarzadeh
250			_a1st ed. 2020.
264		1	_aCham _bSpringer International Publishing _c2020.
300			_a1 recurso en línea (X, 304 páginas) _b104 ilustraciones, 44 ilustraciones a color
336			_2rdacontent _aTexto _btxt
337			_2rdamedia _aelectrónico _bc
338			_2rdacarrier _arecurso electrónico _bcr
347			_atext file _bPDF
490	0		_aStructural Integrity _x2522-560X _v10
490	0		_aEngineering (Springer-11647)
505	0		_aHeat conduction and moisture diffusion theories -- Basic Problems of Non-Fourier Heat Conduction -- Multiphysics of smart materials and structures -- Coupled thermal stresses in advanced and smart materials -- Thermal Fracture of Advanced Materials based on Fourier Heat Conduction -- Advanced thermal fracture analysis based on non-Fourier heat conduction models -- Future Perspectives.
520	3		_aThis is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures. The book contains six chapters and starts with a brief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introduced through reviewing the methods for solving non-Fourier heat conduction theories and by presenting transient heat transport in representative homogeneous and advanced heterogeneous materials. The book provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry. A series of uncoupled thermal stress analyses on one-dimensional structures are also included. The volume ends with coupled thermal stress analyses of one-dimensional homogenous and heterogeneous smart piezoelectric structures considering different coupled thermopiezoelectric theories. Last but not least, fracture behavior of smart structures under thermal disturbance is investigated and the authors propose directions for future research on the topic of multiphysical analysis of smart materials. .
650		7	_2embne _aMateriales inteligentes _9667358
650		7	_2embne _9668004 _aTensiones térmicas
700	1		_aAkbarzadeh, Abdolhamid _eautor
776	0	8	_iPrinted edition: _z9783030252007
776	0	8	_iPrinted edition: _z9783030252021
776	0	8	_iPrinted edition: _z9783030252038
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-3-030-25201-4 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
998			_aSI _cm _dz _feng _ggw _h0 _b11/2019 _eu _zSI