000 04249nam a2200445 c 4500
988 _aSpringer_Engineering_2020
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020 _a9783030202088
024 7 _a10.1007/978-3-030-20208-8
_2doi
040 _aES-MaUEC
_bspa
_cES-MaUEC
_dES-MaUEC
050 4 _aTK7871.15 .G33
_b2020 EB
245 0 0 _aHigh-frequency GaN electronic devices
_cedited by Patrick Fay, Debdeep Jena, Paul Maki
250 _aFirst edition
264 1 _aCham
_bSpringer International Publishing
_c2020
300 _a1 recurso en línea (VIII, 309 páginas)
_b221 ilustraciones, 199 ilustraciones a color
336 _2rdacontent
_aTexto
_btxt
337 _2rdamedia
_aelectrónico
_bc
338 _2rdacarrier
_arecurso electrónico
_bcr
347 _atext file
_bPDF
490 0 _aEngineering (Springer-11647)
505 0 _aChapter 1. Introduction -- Chapter 2.High Power High Frequency Transistors: A Materials Perspective -- Chapter 3. Isotope Engineering of GaN for Boosting Transistor Speeds -- Chapter 4. Linearity Aspects of High Power Amplification in GaN Transistors -- Chapter 5. III-Nitride Tunneling Hot Electron Transfer Amplifier (THETA) -- Chapter 6.Plasma-Wave Propagation in GaN and Its Applications -- Chapter 7.Numerical Simulation of Distributed Electromagnetic and Plasma-wave Effect Devices -- Chapter 8.Resonant Tunneling Transport in Polar III-Nitride Heterostructures -- Chapter 9.Fabrication and Characterization of GaN/AlN Resonant Tunneling Diodes -- Chapter 10.Non-Contact Metrology for mm-wave and THz Electronics.
520 3 _aThis book brings together recent research by scientists and device engineers working on both aggressively-scaled conventional transistors as well as unconventional high-frequency device concepts in the III-N material system. Device concepts for mm-wave to THz operation based on deeply-scaled HEMTs, as well as distributed device designs based on plasma-wave propagation in polarization-induced 2DEG channels, tunneling, and hot-carrier injection are discussed in detail. In addition, advances in the underlying materials science that enable these demonstrations, and advancements in metrology that permit the accurate characterization and evaluation of these emerging device concepts are also included. Targeting readers looking to push the envelope in GaN-based electronics device research, this book provides a current, comprehensive treatment of device concepts and physical phenomenology suitable for applying GaN and related materials to emerging ultra-high-frequency applications. Offers readers an integrated treatment of the state of the art in both conventional (i.e., HEMT) scaling as well as unconventional device architectures suitable for amplification and signal generation in the mm-wave and THz regime using GaN-based devices, written by authors that are active and widely-known experts in the field; Discusses both conventional scaled HEMTs (into the deep mm-wave) as well as unconventional approaches to address the mm-wave and THz regimes; Provides "vertically integrated" coverage, including materials science that enables these recent advances, as well as device physics & design, and metrology techniques; Includes fundamental physics, as well as numerical simulations and experimental realizations.
650 7 _2embne
_aComponentes electrónicos
_9153705
650 7 _2embne
_9140359
_aTransistores
650 7 _2embne
_aSemiconductores
_9140004
700 1 _aFay, Patrick
_eeditor
_4edt
_4http://id.loc.gov/vocabulary/relators/edt
700 1 _aJena, Debdeep
_eeditor
_4edt
_4http://id.loc.gov/vocabulary/relators/edt
700 1 _aMaki, Paul
_eeditor
_4edt
_4http://id.loc.gov/vocabulary/relators/edt
776 0 8 _iPrinted edition:
_z9783030202071
776 0 8 _iPrinted edition:
_z9783030202095
776 0 8 _iPrinted edition:
_z9783030202101
856 4 0 _uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-3-030-20208-8
_zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
942 _2lcc
_cLE
998 _aSI
_cm
_dz
_feng
_ggw
_h0
_b12/2019
_eel
_zSI