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020			_a9789811372247
024	7		_a10.1007/978-981-13-7224-7 _2doi
040			_bspa _dES-MaUEC _cES-MaUEC
050		4	_aTK7874 _b2019 EB
100	1		_aLau, John H. _eautor _9673189
245	1	0	_aHeterogeneous Integrations _cJohn H. Lau
264		1	_aSingapore _bSpringer Singapore : _bImprint: Springer _c2019.
300			_a1 recurso en línea (XXII, 368 páginas) _b386 ilustraciones, 342 ilustraciones a color
336			_2rdacontent _aTexto _btxt
337			_2rdamedia _aelectrónico _bc
338			_2rdacarrier _arecurso electrónico _bcr
347			_atext file _bPDF
490	0		_aEngineering (Springer-11647)
505	0		_aChapter 1. Overview of 3D IC Heterogeneous Integrations -- Chapter 2. RDLs for Heterogeneous Integrations on Organic Substrates -- Chapter 3. RDLs for Heterogeneous Integration on Silicon (TSV-Interposers) -- Chapter 4. RDLs for Heterogeneous Integration on Silicon (Bridges) -- Chapter 5. RDLs for Heterogeneous Integration on Fan-Out Substrates -- Chapter 6. 3D IC Heterogeneous Integration in Memory Stacking -- Chapter 7. 3D IC Heterogeneous Integration in PoP Formats -- Chapter 8. 3D IC Heterogeneous Integration in Chip-to-Chip Formats -- Chapter 9. 3D IC Heterogeneous Integration with LED and VCSEL -- Chapter 10. Future Trends of 3D IC Heterogeneous Integrations.
520	3		_aHeterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
988			_aPrimersemestre_2019_Engineering
650		7	_aCircuitos integrados híbridos _2embne _9673188
650		7	_aElectrónica _2embne _9138690
650		7	_aIngeniería de sistemas _2embne _9138451
776	0	8	_iPrinted edition: _z9789811372230
776	0	8	_iPrinted edition: _z9789811372254
776	0	8	_iPrinted edition: _z9789811372261
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-981-13-7224-7 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
942			_2lcc _cLE
998			_dz _feng _ggw _h0 _b04/2020 _eo _zSI