000			03679nam a22003975i 4500
710	2		_aSpringerLink (Online service) _9106996
999			_c110891 _d110891
001			110891
003			ES-MaUEC
005			20230102113443.0
006			a||||fo|||| 00| 0
007			cr nn nnnaamaa
008			181220s2019 gw a o |||| 0|eng d
020			_a9783319936833
024	7		_a10.1007/978-3-319-93683-3 _2doi
040			_bspa _dES-MaUEC _cES-MaUEC
050		4	_aTA169 _b2019 EB
100	1		_aMcPherson, J. W. _eautor _9671174 _q(Joe W.)
245	1	0	_aReliability Physics and Engineering : _bTime-To-Failure Modeling _cby J. W. McPherson.
250			_a3rd ed. 2019
264		1	_aCham _bImprint: Springer _c2019
300			_a1 recurso en línea (XVII, 463 páginas) _b207 ilustraciones, 164 ilustraciones a color
336			_2rdacontent _aTexto _btxt
337			_2rdamedia _aelectrónico _bc
338			_2rdacarrier _arecurso electrónico _bcr
347			_atext file _bPDF
490	0		_aEngineering (Springer-11647)
505	0		_aIntroduction -- Physics of Degradation -- Time Dependence of Materials and Device Degradation -- From Material/Device Degradation to Time-To-Failure -- Time-To-Failure Modeling -- Gaussian Statistics - An Overview -- Time-To-Failure Statistics -- Failure Rate Modeling -- Accelerated Degradation -- Acceleration Factor Modeling -- Ramp-To-Failure Testing -- Time-To-Failure Models for Selected Failure Mechanisms in Integrated Circuits -- Time-To-Failure Models for Selected Failure Mechanisms in Mechanical Engineering -- Conversion of Dynamical Stresses Into Effective Static Values -- Resonance and Resonance-Induced Degradation -- Increasing the Reliability of Device/Product Designs -- Screening -- Heat Generation and Dissipation -- Sampling Plans and Confidence Intervals -- .
520	3		_aThis third edition textbook provides the basics of reliability physics and engineering that are needed by electrical engineers, mechanical engineers, civil engineers, biomedical engineers, materials scientists, and applied physicists to help them to build better devices/products. The information contained within should help all fields of engineering to develop better methodologies for: more reliable product designs, more reliable materials selections, and more reliable manufacturing processes- all of which should help to improve product reliability. A mathematics level through differential equations is needed. Also, a familiarity with the use of excel spreadsheets is assumed. Any needed statistical training and tools are contained within the text. While device failure is a statistical process (thus making statistics important), the emphasis of this book is clearly on the physics of failure and developing the reliability engineering tools required for product improvements during device-design and device-fabrication phases. Provides a comprehensive textbook on reliability physics of semiconductors, from fundamentals to applications; Explains the fundamentals of reliability physics and engineering tools for building better products; Contains statistical training and tools within the text; Includes new chapters on Physics of Degradation, and Resonance and Resonance-Induced Degradation.
650		7	_2embne _aFiabilidad (Ingeniería) _9141577
776	0	8	_iPrinted edition: _z9783319936826
776	0	8	_iPrinted edition: _z9783319936840
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-3-319-93683-3 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
942			_2lcc _cLE
988			_aPrimersemestre_2019_Engineering
998			_aSI _cm _dz _feng _ggw _h0 _b10/2019 _ek _zSI