000			03249nam a22004215i 4500
710	2		_aSpringerLink (Online service) _9106996
999			_c110885 _d110885
001			110885
003			ES-MaUEC
005			20230102113443.0
006			a||||fo|||| 00| 0
007			cr nn nnnaamaa
008			190326s2019 gw a o |||| 0|eng d
020			_a9783030146900
024	7		_a10.1007/978-3-030-14690-0 _2doi
040			_bspa _dES-MaUEC _cES-MaUEC
050		4	_aQC665.T7 _b2019 EB
100	1		_aBožanić, Mladen _d1982- _eautor _9671202
245	1	0	_aSystems-Level Packaging for Millimeter-Wave Transceivers _cby Mladen Božanić, Saurabh Sinha.
264		1	_aCham _bImprint: Springer _c2019
300			_a1 recurso en línea (XV, 277 páginas)
336			_2rdacontent _aTexto _btxt
337			_2rdamedia _aelectrónico _bc
338			_2rdacarrier _arecurso electrónico _bcr
347			_atext file _bPDF
490	0		_aEngineering (Springer-11647)
490	0		_aSmart Sensors Measurement and Instrumentation _x2194-8402 _v34
505	0		_aIntroduction and Research Impact -- Millimeter-Wave Research Challenges.-Behavior of Active and Passive Devices at Millimeter-Wave Frequencies -- Integrated Substrates: Millimeter-Wave Transistor Technologies -- Discrete Substrates: Package Foundation -- Traditional Approach: System-on-Chip -- Multi-Chip Modules and Multi-Chip Packaging -- State-of-the-Art Approach: System-on-Package -- Evaluation of Research Questions, Remaining Research Gaps and Future Directions.
520	3		_aThis book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.
650		7	_2embne _9671203 _aOndas electromagnéticas _xPropagación
700	1		_aSinha, S. _q(Saurabh), _d1981- _eautor _4aut _4http://id.loc.gov/vocabulary/relators/aut _998411
776	0	8	_iPrinted edition: _z9783030146894
776	0	8	_iPrinted edition: _z9783030146917
776	0	8	_iPrinted edition: _z9783030146924
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-3-030-14690-0 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
942			_2lcc _cLE
988			_aPrimersemestre_2019_Engineering
998			_aSI _cm _dz _feng _ggw _h0 _b10/2019 _ek _zSI