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_c110765 _d110765 _x1 |
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| 001 | 110765 | ||
| 003 | ES-MaUEC | ||
| 005 | 20230102113437.0 | ||
| 006 | a||||fo|||| 00| 0 | ||
| 007 | cr nn nnnaamaa | ||
| 008 | 190423s2019 si a o |||| 0|eng d | ||
| 020 | _a9789811336270 | ||
| 024 | 7 |
_a10.1007/978-981-13-3627-0 _2doi |
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| 040 |
_bspa _dES-MaUEC _cES-MaUEC |
||
| 050 | 4 |
_aTK7870.15 _b2019 EB |
|
| 100 | 1 |
_aHuang, YongAn _eautor _9670709 |
|
| 245 | 1 | 0 |
_aModeling and Application of Flexible Electronics Packaging _cby YongAn Huang, Zhouping Yin, Xiaodong Wan |
| 264 | 1 |
_aSingapore _bSpringer Singapore : _bImprint: Springer _c2019 |
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| 300 | _a1 recurso en línea (XVII, 287 páginas) | ||
| 336 |
_2rdacontent _aTexto _btxt |
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| 337 |
_2rdamedia _aelectrónico _bc |
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| 338 |
_2rdacarrier _arecurso electrónico _bcr |
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| 347 |
_atext file _bPDF |
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| 490 | 0 | _aEngineering (Springer-11647) | |
| 505 | 0 | _aAdvanced Electronics Packaging -- Interfacial Modeling of Flexible Multilayer Structures -- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy -- Shear-Assisted Peeling -- Single-Needle Peeling -- Multi-Needle Peeling -- Conformal Peeling -- Laser Lift-Off -- Vacuum-Based Picking-up and Placing-on. | |
| 520 | 3 | _aThis book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics. | |
| 650 | 7 |
_2embne _aElectrónica _9138690 |
|
| 700 | 1 |
_aYin, Zhouping _eautor _9670710 |
|
| 700 | 1 |
_aWan, Xiaodong _eautor _9670711 |
|
| 710 | 2 |
_aSpringerLink (Online service) _9106996 |
|
| 776 | 0 | 8 |
_iPrinted edition: _z9789811336263 |
| 776 | 0 | 8 |
_iPrinted edition: _z9789811336287 |
| 856 | 4 | 0 |
_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-981-13-3627-0 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid) |
| 942 |
_2lcc _cLE |
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| 988 | _aPrimersemestre_2019_Engineering | ||
| 998 |
_aSI _cm _dz _feng _ggw _h0 _b09/2019 _eel _zSI |
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