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_c110487 _d110487 _x1 |
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| 001 | 110487 | ||
| 003 | ES-MaUEC | ||
| 005 | 20230102113423.0 | ||
| 006 | a||||fo|||| 00| 0 | ||
| 007 | cr nn nnnaamaa | ||
| 008 | 180725s2019 gw a o |||| 0|eng d | ||
| 020 | _a9783319693958 | ||
| 024 | 7 |
_a10.1007/978-3-319-69395-8 _2doi |
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| 040 |
_bspa _dES-MaUEC _cES-MaUEC |
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| 050 | 4 |
_aTK7870 _b2019 EB |
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| 100 | 1 |
_aSerksnis, Tony _eautor _9670151 |
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| 245 | 1 | 0 |
_aDesigning Electronic Product Enclosures _cTony Serksnis |
| 264 | 1 |
_aCham _bSpringer International Publishing : _bImprint: Springer _c2019 |
|
| 300 |
_a1 recurso en línea (XXI, 211 páginas) _b56 ilustraciones |
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| 336 |
_2rdacontent _aTexto _btxt |
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| 337 |
_2rdamedia _aelectrónico _bc |
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| 338 |
_2rdacarrier _arecurso electrónico _bcr |
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| 347 |
_atext file _bPDF |
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| 490 | 0 | _aEngineering (Springer-11647) | |
| 505 | 0 | _aIntroduction and Author's Credentials -- Outline of Text -- Successful Design -- Building the Design -- Structural Considerations. | |
| 520 | 3 | _aThis text explains the process of the design of product electronic enclosures. These products typically contain a printed circuit board. The text takes the reader from the original idea for a product, through the shipment in quantity to a customer. For the product enclosure designer, this proceeds through design layout, material selection, prototype building, testing, and ongoing design improvement. The book presents a substantive and lucid treatment of the structural, thermal, user-interface, assembly, quality control, and cost considerations of the product enclosure. Of special note is a discussion on the regulatory issues involved with the design of a product. A main thrust of the text is on the "commercialization" aspects of electronic products, that is, when an enclosure is needed for the product to meet environmental and certification requirements globally. The book targets the broadest audience tasked to design/manufacture an enclosure, from mechanical/industrial engineers to designers and technicians. While the intent of the text is not to provide a complete understanding of relevant physical phenomena addressed (strength of materials, shock and vibration, heat transfer), the book provides a ready reference on how and where these key properties may be considered in the design of most electronic enclosures. Elucidates successful enclosure design for electronic products, defining the design team and the definition of success Explains the processes for building enclosures, including printed circuit board layout (mechanical considerations) and optimal object placement, structural considerations, material selection, and user interface design Includes treatment of serviceability, product environments, standards and testing, cooling techniques as well as guidelines for Electromagnetic Compliance (EMC) standards and testing required to pass FCC/CE Reinforces design concepts presented with relevant solved problems. | |
| 650 | 7 |
_2embne _9138690 _aElectrónica |
|
| 710 | 2 |
_aSpringerLink (Online service) _9106996 |
|
| 776 | 0 | 8 |
_iPrinted edition: _z9783030098872 |
| 776 | 0 | 8 |
_iPrinted edition: _z9783319693941 |
| 776 | 0 | 8 |
_iPrinted edition: _z9783319693965 |
| 856 | 4 | 0 |
_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-3-319-69395-8 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid) |
| 942 |
_2lcc _cLE |
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| 988 | _aPrimersemestre_2019_Engineering | ||
| 998 |
_aSI _cm _dz _feng _ggw _h0 _b07/2019 _eel _zSI |
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