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020 _a9789811088841
024 7 _a10.1007/978-981-10-8884-1
_2doi
040 _aES-MaUEC
_bspa
_cES-MaUEC
_dES-MaUEC
050 4 _aTK7870.17 2018 EB
100 1 _aLau, John H
_eautor
_4aut
_4http://id.loc.gov/vocabulary/relators/aut
245 1 0 _aFan-Out Wafer-Level Packaging
_cby John H. Lau.
264 1 _aSingapore
_bSpringer Singapore :
_bImprint: Springer
_c2018.
300 _a (1 recurso en línea XX, 303 páginas, 278 ilustraciones, 226 ilustraciones a color)
336 _2rdacontent
_aTexto
_btxt
337 _2rdamedia
_aelectrónico
_bc
338 _2rdacarrier
_arecurso electrónico
_bcr
347 _atext file
_bPDF
_2rda
490 _aEngineering (Springer-11647)
505 0 _aPatent Issues of Fan-out Wafer-Level Packaging -- Flip Chip Technology vs. FOWLP -- Fan-In Wafer-Level Packaging vs. FOWLP -- Embedded Chip Packaging -- FOWLP: Chip-First and Die Face-Down -- FOWLP: Chip-First and Die Face-Up -- FOWLP: Chip-Last or RDL-First -- FOWLP: PoP with FOWLP -- Fan-Out Panel-Level Packaging (FOPLP) -- 3D Integration -- Heterogeneous Integration.
520 _aThis comprehensive guide to fan-out wafer-level packaging (FOWLP) technology compares FOWLP with flip chip and fan-in wafer-level packaging. It presents the current knowledge on these key enabling technologies for FOWLP, and discusses several packaging technologies for future trends. The Taiwan Semiconductor Manufacturing Company (TSMC) employed their InFO (integrated fan-out) technology in A10, the application processor for Apple’s iPhone, in 2016, generating great excitement about FOWLP technology throughout the semiconductor packaging community. For many practicing engineers and managers, as well as scientists and researchers, essential details of FOWLP – such as the temporary bonding and de-bonding of the carrier on a reconstituted wafer/panel, epoxy molding compound (EMC) dispensing, compression molding, Cu revealing, RDL fabrication, solder ball mounting, etc. – are not well understood. Intended to help readers learn the basics of problem-solving methods and understand the trade-offs inherent in making system-level decisions quickly, this book serves as a valuable reference guide for all those faced with the challenging problems created by the ever-increasing interest in FOWLP, helps to remove roadblocks, and accelerates the design, materials, process, and manufacturing development of key enabling technologies for FOWLP.
650 7 _aCircuitos integrados
_2embne
_9139614
776 0 8 _iPrinted edition:
_z9789811088834
776 0 8 _iPrinted edition:
_z9789811088858
856 4 0 _uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-981-10-8884-1
942 _2lcc
_cLE
998 _b03/2019
_dz
_ep
_feng
_ggw
_h0