000			02676nam a22003735i 4500
999			_c103936 _d103936 _x1
001			103936
003			DE-He213
005			20230102113152.0
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007			cr nn 008mamaa
008			150411s2015 gw | s |||| 0|eng d
020			_a9783642253768
024	7		_a10.1007/978-3-642-25376-8 _2doi
040			_bspa _dES-MaUEC
050		4	_aTA1520 _b2015 EB
100	1		_aFischer-Hirchert, Ulrich H. P. _eautor _4aut _4http://id.loc.gov/vocabulary/relators/aut _1http://viaf.org/viaf/72314904/
245	1	0	_aPhotonic Packaging Sourcebook _bFiber-Chip Coupling for Optical Components, Basic Calculations, Modules _cby Ulrich H. P. Fischer-Hirchert.
264		1	_aBerlin, Heidelberg _bSpringer International Publishing _c2015
300			_a1 recurso en línea (XIX, 325 páginas 287 ilustraciones, 16 ilustraciones a color.)
336			_2rdacontent _aTexto (visual) _btxt
337			_2rdamedia _aelectrónico _bc
338			_2rdacarrier _arecurso electrónico _bcr
490	0		_aEngineering (Springer-11647)
505	0		_aIntroduction into Photonic Packaging -- Optical waveguides -- Optical Mode Field Adaptation -- Fiber-chip-coupling -- RF Lines -- Soldering, Adhesive Bonding, Bonding -- Optical Coneection Technology -- Active Adjustment Techniques -- Passive Adjustment Techniques -- Optical Motherboard -- Fiber-Optic Modules -- From Chip Design to the Optimum Package -- Reliability Tests -- Abbreviations -- Index.
520	3		_aThis book serves as a guide on photonic assembly techniques. It provides an overview of today's state-of-the-art technologies for photonic packaging experts and professionals in the field. The text guides the readers to the practical use of optical connectors. It also assists engineers to find a way to an effective and inexpensive set-up for their own needs. In addition, many types of current industrial modules and state-of-the-art applications from single fiber to multi fiber are described in detail. Simulation techniques such as FEM, BPM and ray tracing are explained in depth. Finally, all recent reliability test procedures for datacom and telecom modules are illustrated in combination with related standardization aspects.
988			_aEBSPRINGER_2018
650		7	_2embne _aFotónica _9150920
776	0	8	_iEdición impresa: _z9783642253775
776	0	8	_iEdición impresa: _z9783642253751
776	0	8	_iEdición impresa: _z9783662521359
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-3-642-25376-8 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
942			_2lcc _cLE
998			_b05/2019 _dz _ejf _zSI