000			03585nam a22004095i 4500
999			_c103608 _d103608 _x1
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005			20230102113138.0
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007			cr nn 008mamaa
008			141105s2015 xxu| s |||| 0|eng d
020			_a9781461492665
024	7		_a10.1007/978-1-4614-9266-5 _2doi
040			_bspa _dES-MaUEC
050		4	_aTK7836 _b.L448 2015 EB
100	1		_aLee, Tae-Kyu. _eautor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _1http://viaf.org/viaf/103226455/
245	1	0	_aFundamentals of Lead-Free Solder Interconnect Technology _bFrom Microstructures to Reliability _cby Tae-Kyu Lee, Thomas R. Bieler, Choong-Un Kim, Hongtao Ma.
264		1	_aBoston, MA _bSpringer International Publishing _c2015
300			_a1 recurso en línea (XIII, 253 páginas 151 ilustraciones, 81 ilustraciones a color.)
336			_2rdacontent _aTexto (visual) _btxt
337			_2rdamedia _aelectrónico _bc
338			_2rdacarrier _arecurso electrónico _bcr
490	0		_aEngineering (Springer-11647)
505	0		_aIntroduction -- Interconnection : The Joint -- Phase Equilibria and Microstructure of Sn-Ag-Cu Alloys -- Microstructure Development; Solidification and Isothermal Aging -- Thermal Cycling Performance -- Mechanical Stability and Performance -- Chemical and Environment Attack -- Challenges in Future Generation Interconnects: Microstructure Again.
520	3		_aThis unique book provides an up-to-date overview of the fundamental concepts behind lead-free solder and interconnection technology. Readers will find a description of the rapidly increasing presence of electronic systems in all aspects of modern life as well as the increasing need for predictable reliability in electronic systems. The physical and mechanical properties of lead-free solders are examined in detail, and building on fundamental science, the mechanisms responsible for damage and failure evolution, which affect reliability of lead-free solder joints are identified based on microstructure evolution.  The continuing miniaturization of electronic systems will increase the demand on the performance of solder joints, which will require new alloy and processing strategies as well as interconnection design strategies. This book provides a foundation on which improved performance and new design approaches can be based.  In summary, this book:  Provides an up-to-date overview on lead-free soldering technologies   Covers the fundamentals, implementation, reliability, challenges and risks of lead-free soldering technique Explores emerging technologies in lead-free soldering.
988			_aEBSPRINGER_2018
650		7	_9140220 _aSoldadura
700	1		_aBieler, Thomas R. _eautor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _0http://id.loc.gov/authorities/names/n94102780 _1http://viaf.org/viaf/92379205/
700	1		_aKim, Choong-Un. _eautor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _0http://id.loc.gov/authorities/names/no2011193963 _1http://viaf.org/viaf/186819139/
700	1		_aMa, Hongtao. _eautor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _0http://id.loc.gov/authorities/names/nb2014013687 _1http://viaf.org/viaf/310520522/
776	0	8	_iEdición impresa: _z9781461492658
776	0	8	_iEdición impresa: _z9781461492672
776	0	8	_iEdición impresa: _z9781489978011
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-1-4614-9266-5 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
942			_2lcc _cLE
998			_b03/2019 _dz _eIG _zSI