000			04368nam a22003975i 4500
999			_c103304 _d103304
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007			cr nn 008mamaa
008			141120s2015 gw | s |||| 0|eng d
020			_a9783319128627
024	7		_a10.1007/978-3-319-12862-7 _2doi
040			_aES-MaUEC _bspa _cES-MaUEC _dES-MaUEC
050		4	_aQD480 _b.M654 2015 EB
245	1	0	_aMolecular Modeling and Multiscaling Issues for Electronic Material Applications _bVolume 2 _cedited by Artur Wymyslowski, Nancy Iwamoto, Matthew Yuen, Haibo Fan.
264		1	_aCham _bSpringer International Publishing _c2015
300			_a1 recurso en línea (X, 194 páginas 153 ilustraciones, 77 ilustraciones a color.)
336			_2rdacontent _aTexto _btxt
337			_2rdamedia _aelectrónico _bc
338			_2rdacarrier _arecurso electrónico _bcr
490	0		_aEngineering (Springer-11647)
505	0		_aMolecular Modeling of pH-Dependent Properties of Emeraldine Base Polyaniline for pH-Based Chemical Sensors -- Two Approaches of Study Cu/Epoxy Interface Enhancement with Benzenethiol Promoter -- Molecular Dynamics Simulation of Pore Formation Mechanism for Deposition of Poly (vinylidene fluoride-co-trifluoroethylene) on Gold Substrate -- Investigating the Influence of Moisture by Molecular Dynamics Simulations -- Analysis of the Adhesion Work with a Molecular Modeling Method and a Wetting Angle Measurement -- Using Coarse-Grained Molecular Models (Molecular-Mesocale) of a Copper Oxide-Epoxy Interface to Obtain Stress-Strain Failure Predictions which Include Interfacial Roughness, Water and Filler Effects -- Establishment of the Mesoscale Parameters for Separation: A Non-Equilibrium Molecular Dynamics Model -- Mechanics of Graphene and Carbon Nanotubes under Uniaxial Compression and Tension -- Analysis of an Influence of a Conversion Level on Simulation Results of the Crosslinked Polymers.
520	3		_aThis book offers readers a snapshot of the progression of molecular modeling in the electronics industry and how molecular modeling is currently being used to understand materials to solve relevant issues in this field. The reader is introduced to the evolving role of molecular modeling, especially seen from the perspective of the IEEE community and modeling in electronics. This book also covers the aspects of molecular modeling needed to understand the relationship between structures and mechanical performance of materials. The authors also discuss the transitional topic of multiscale modeling and recent developments on the atomistic scale and current attempts to reach the submicron scale, as well as the role that quantum mechanics can play in performance prediction. This book also: Discusses multiscale modeling of materials at the mesoscale Highlights current state-of-the-art, novel research topics and achievements in the area of molecular modelling and multiscaling problems of electronic materials and their applications as well as atomistic modeling of mechanical properties Provides practical examples for engineers interested in molecular modeling using simulations drawn from electronic packaging, dielectric materials, and thermal and mechanical properties.
650		7	_aMoléculas _xModelos _2embne _9138247
700	1		_aWymyslowski, Artur _eeditor literario _4edt _4http://id.loc.gov/vocabulary/relators/edt _1http://viaf.org/viaf/103041006/
700	1		_aIwamoto, Nancy _eeditor literario _4edt _4http://id.loc.gov/vocabulary/relators/edt _0http://id.loc.gov/authorities/names/no2015078049 _1http://viaf.org/viaf/286377500/
700	1		_aYuen, Matthew _eeditor literario _4edt _4http://id.loc.gov/vocabulary/relators/edt _0http://id.loc.gov/authorities/names/no2015078162 _1http://viaf.org/viaf/291349623/
700	1		_aFan, Haibo _eeditor literario _4edt _4http://id.loc.gov/vocabulary/relators/edt _0http://id.loc.gov/authorities/names/no2015078163 _1http://viaf.org/viaf/287271499/
776	0	8	_iEdición impresa: _z9783319128610
776	0	8	_iEdición impresa: _z9783319128634
776	0	8	_iEdición impresa: _z9783319366661
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-3-319-12862-7 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
942			_2lcc _cLE
998			_b03/2019 _dz _ef _feng _ggw _h0