| 000 | 03365nam a22003375i 4500 | ||
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| 001 | 103215 | ||
| 003 | DE-He213 | ||
| 005 | 20230102113120.0 | ||
| 007 | cr nn 008mamaa | ||
| 008 | 150625s2015 gw | s |||| 0|eng d | ||
| 020 | _a9783319191744 | ||
| 024 | 7 |
_a10.1007/978-3-319-19174-4 _2doi |
|
| 050 | 4 |
_aTK7895.G36 _bP364 2015 EB |
|
| 040 |
_aES-MaUEC _bspa |
||
| 100 | 1 |
_aPangracious, Vinod _eautor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _0http://id.loc.gov/authorities/names/nb2015015800 _1http://viaf.org/viaf/314926177/ |
|
| 245 | 1 | 0 |
_aThree-Dimensional Design Methodologies for Tree-based FPGA Architecture _cby Vinod Pangracious, Zied Marrakchi, Habib Mehrez. |
| 264 | 1 |
_aCham _bSpringer International Publishing _c2015 |
|
| 300 | _a1 recurso en línea (XXI, 226 páginas 113 ilustraciones, 102 ilustraciones a color.) | ||
| 490 | 0 |
_aLecture Notes in Electrical Engineering _x1876-1100 ; _v350 |
|
| 505 | 0 | _aAn Overview of Three-Dimensional Integration and FPGAs -- Three-Dimensional Integration: A More Than Moore Technology -- Field Programmable Gate Arrays: An Overview -- Two Dimensional FPGAs: Configuration and CAD Flow -- Three-Dimensional FPGAs: Configuration and CAD Development -- Three-Dimensional Tree-based FPGA: Architecture Exploration Tools and Technologies -- Three-Dimensional Thermal Modeling: Tools and Methodologies -- Physical Design and Implementation of 3D Tree-based FPGAs -- Three-Dimensional FPGAs: Future Lines of Research. | |
| 520 | 3 | _aThis book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike. | |
| 650 | 7 |
_aDispositivos FPGAs _2embne _9667973 |
|
| 700 | 1 |
_aMarrakchi, Zied _eautor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _0http://id.loc.gov/authorities/names/nb2012020965 _1http://viaf.org/viaf/205105392/ |
|
| 700 | 1 |
_aMehrez, Habib _eautor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _0http://id.loc.gov/authorities/names/nb2011024884 _1http://viaf.org/viaf/186081839/ |
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| 776 | 0 | 8 |
_iEdición impresa: _z9783319191751 |
| 776 | 0 | 8 |
_iEdición impresa: _z9783319191737 |
| 776 | 0 | 8 |
_iEdición impresa: _z9783319386874 |
| 856 | 4 | 0 |
_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-3-319-19174-4 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid) |
| 490 | 0 | _aEngineering (Springer-11647) | |
| 998 |
_b03/2019 _dz _ef _feng _ggw _h0 |
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| 999 |
_c103215 _d103215 _x1 |
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