000			03418nam a22003375i 4500
001			102826
003			DE-He213
005			20230102113101.0
007			cr nn 008mamaa
008			170524s2018 gw | s |||| 0|eng d
020			_a9783662548233
024	7		_a10.1007/978-3-662-54823-3 _2doi
050		4	_aTJ241 _b.T673 2018 EB
100	1		_aTo, Sandy Suet _eautor _4aut _4http://id.loc.gov/vocabulary/relators/aut
245	1	0	_aMaterials Characterisation and Mechanism of Micro-Cutting in Ultra-Precision Diamond Turning _cby Sandy Suet To, Hao Wang, Wing Bing Lee.
264		1	_aBerlin, Heidelberg _bSpringer International Publishing _c2018
300			_a1 recurso en línea (X, 266 páginas 199 ilustraciones)
347			_atext file _bPDF
505	0		_aIntroduction -- Basic Concepts and Theory -- Machinability of Single Crystals in Diamond Turning -- Deformation Behaviour of Diamond-Turned Surface Layer -- Orientation Changes of Substrate Materials -- Influences of Material Swelling Upon Surface Roughness -- A Microplasticity Analysis of Shear Angle, and Micro-cutting Force Variation -- Crystal Plasticity Finite Element Modeling of Orthogonal Cutting of Single Crystal Materials -- Elastic Strain Induced Shear Bands in the Micro-cutting Process.
520	3		_aThis book presents an in-depth study and elucidation on the mechanisms of the micro-cutting process, with particular emphasis and a novel viewpoint on materials characterization and its influences on ultra-precision machining. Ultra-precision single point diamond turning is a key technology in the manufacture of mechanical, optical and opto-electronics components with a surface roughness of a few nanometers and form accuracy in the sub-micrometric range. In the context of subtractive manufacturing, ultra-precision diamond turning is based on the pillars of materials science, machine tools, modeling and simulation technologies, etc., making the study of such machining processes intrinsically interdisciplinary. However, in contrast to the substantial advances that have been achieved in machine design, laser metrology and control systems, relatively little research has been conducted on the material behavior and its effects on surface finish, such as the material anisotropy of crystalline materials. The feature of the significantly reduced depth of cut on the order of a few micrometers or less, which is much smaller than the average grain size of work-piece materials, unavoidably means that conventional metal cutting theories can only be of limited value in the investigation of the mechanisms at work in micro-cutting processes in ultra-precision diamond turning.
650		7	_aMáquinas _2embne _9138097
700	1		_aWang, Hao _0http://id.loc.gov/authorities/names/n83173546 _1http://viaf.org/viaf/4957151/ _1http://dbpedia.org/resource/Hao_Wang_(academic)
700	1		_aLee, Wing Bing _eautor _4aut _4http://id.loc.gov/vocabulary/relators/aut
776	0	8	_iEdición impresa: _z9783662548219
776	0	8	_iEdición impresa: _z9783662548226
776	0	8	_iEdición impresa: _z9783662572108
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-3-662-54823-3 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
490	0		_aEngineering (Springer-11647)
988			_aEBSPRINGER_2018
998			_b01/2019 _dz _ea _feng _ggw _h0
999			_c102826 _d102826 _x1