000			05227nam a22003975i 4500
710	2		_aSpringerLink (Online service) _0http://id.loc.gov/authorities/names/no2005046756 _1http://viaf.org/viaf/274647764/ _9106996
999			_c102771 _d102771 _x1
001			102771
003			DE-He213
005			20230102113058.0
006			a||||fo|||| 00| 0
007			cr nn 008mamaa
008			180223s2018 gw | s |||| 0|eng d
020			_a9783319735580
024	7		_a10.1007/978-3-319-73558-0 _2doi
040			_bspa _cES-MaUEC _dES-MaUEC
050		4	_aTK7874 _b2018 EB
100	1		_aLienig, Jens _9673400
245	1	0	_aFundamentals of Electromigration-Aware Integrated Circuit Design _cby Jens Lienig, Matthias Thiele
264		1	_aCham _bSpringer International Publishing _c2018
300			_a1 recurso en línea (XIII, 159 páginas) _b99 ilustraciones, 95 ilustraciones a color
336			_2rdacontent _aTexto _btxt
337			_2rdamedia _aelectrónico _bc
338			_2rdacarrier _arecurso electrónico _bcr
347			_atext file _bPDF
490	0		_aEngineering (Springer-11647)
505	0		_aIntroduction -- Fundamentals of Electromigration -- Integrated Circuit Design and Electromigration -- Mitigating Electromigration in Physical Design -- Summary and Outlook.
520	3		_aThe book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration's negative impact on circuit reliability. Enables readers to understand and meet challenges of electromigration, including its effects on the reliability of electronic systems Accessible to readers of varying backgrounds and experience levels, combining practical application with theoretical underpinnings. Extensive use of multi-color illustrations, for rapid and clear understanding Multiple examples and hands-on instructions for the practical application of counter measures. "This unique book provides the fundamental science necessary for a sound grounding from which to make practical use of the complete and indispensable application-oriented information regarding the electromigration-aware design of electronic systems. It is a foundational reference for today's design professionals, as well as for the next generation of engineering students." Prof. Worthy Martin, University of Virginia "This is a long-awaited book bridging the design and reliability methodologies imperative for generating robust and high-performing semiconductor devices. A deep insight into physics of the electromigration induced degradation of on-chip interconnect components as well as explaining a design specific failure development are beneficial for both the chip-design and materials engineering communities." Dr. Valeriy Sukharev, D2S Calibre Division of Mentor, a Siemens Business "As digital electronic circuits scale down, it is getting increasingly difficult to maintain digital abstractions against a variety of physical phenomena, such as electromigration. This book summarizes our current understanding of electromigration and how its effects can be moderated in practice. Particularly important and valuable are techniques that can address electromigration in modern automated design flows." Prof. Igor Markov, University of Michigan "This timely book builds a fundamental knowledge of electromigration as well as discussing methods for designing robust integrated circuits. It covers electromigration, methodologies for electromigration-aware design for analog and digital circuits, and methods for mitigating electromigration during the physical design, all in-depth. Rarely, one can find a book with such scope and such practical applications. This book is an excellent resource for new and experienced IC designers." Prof. Laleh Behjat, University of Calgary "Good to have this book that walks the readers through a wonderful journey from understanding the basics and background of electromigration in circuit reliability to its physical process and the counter measures in physical design. It can help greatly people in different disciplines to understand these important topics and work towards better solutions in future technologies." Prof. Evangeline F.Y. Young, The Chinese University of Hong Kong.
988			_aEBSPRINGER_2018
650		7	_2embne _aCircuitos integrados _xDiseño y construcción _9179611
700	1		_aThiele, Matthias. _eautor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _0http://id.loc.gov/authorities/names/nr99036620 _1http://viaf.org/viaf/35239055/
776	0	8	_iEdición impresa: _z9783319735573
776	0	8	_iEdición impresa: _z9783319735597
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-3-319-73558-0 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
942			_2lcc _cLE
998			_b05/2020 _dz _eu _zSI