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007			cr nn 008mamaa
008			170908s2018 si | s |||| 0|eng d
020			_a9789811061653
024	7		_a10.1007/978-981-10-6165-3 _2doi
040			_bspa _cES-MaUEC _dES-MaUEC
050		4	_aTK7874.84 _bC446 2018 EB
100	1		_aCheng, Jie _0http://id.loc.gov/authorities/names/n78039874 _1http://viaf.org/viaf/4957151/
245	1	0	_aResearch on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect _cby Jie Cheng.
264		1	_aSingapore _bSpringer International Publishing _c2018
300			_a1 recurso en línea (XVIII, 137 páginas 103 ilustraciones)
336			_2rdacontent _aTexto _btxt
337			_2rdamedia _aelectrónico _bc
338			_2rdacarrier _arecurso electrónico _bcr
347			_atext file _bPDF
490	0		_aSpringer Theses, Recognizing Outstanding Ph.D. Research, _x2190-5053
490	0		_aEngineering (Springer-11647)
520	3		_aThis thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.
988			_aEBSPRINGER_2018
650		7	_2embne _9139614 _aCircuitos integrados
710	2		_aSpringerLink (Online service) _0http://id.loc.gov/authorities/names/no2005046756 _1http://viaf.org/viaf/274647764/ _9106996
776	0	8	_iEdición impresa: _z9789811061646
776	0	8	_iEdición impresa: _z9789811061660
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-981-10-6165-3 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
942			_2lcc _cLE