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008			171116s2018 gw | s |||| 0|eng d
020			_a9783319696737
024	7		_a10.1007/978-3-319-69673-7 _2doi
040			_bspa _cES-MaUEC _dES-MaUEC
050		4	_aTK7874.75 _bS295 2018 EB
100	1		_aSayil, Selahattin. _eautor. _4aut _4http://id.loc.gov/vocabulary/relators/aut _998922
245	1	0	_aContactless VLSI Measurement and Testing Techniques _cby Selahattin Sayil.
264		1	_aCham _bSpringer International Publishing _c2018
300			_a1 recurso en línea (V, 93 páginas 34 ilustraciones, 11 ilustraciones a color.)
336			_2rdacontent _aTexto _btxt
337			_2rdamedia _aelectrónico _bc
338			_2rdacarrier _arecurso electrónico _bcr
347			_atext file _bPDF
490	0		_aEngineering (Springer-11647)
505	0		_a1. Conventional Test Methods. - 2. Testability Design -- 3. Other Techniques Based on the Contacting Probe -- 4. Contactless Testing -- 5. Electron-Beam and Photoemission Probing -- 6. Electro Optic Sampling and Charge Density Probe -- 7. Electric Force Microscope, Capacitive Coupling and Scanning Magneto-Resistive Probe -- 8. Probing Techniques Based on Light Emission from Chip -- 9. All Silicon Optical Technology for Contactless Testing of Integrated Circuits -- 10. Comparison of Contactless Testing Methodologies.
520	3		_aThis book provides readers with a comprehensive overview of the state-of-the-art in optical contactless probing approaches, in order to fill a gap in the literature on VLSI Testing.  The author highlights the inherent difficulties encountered with the mechanical probe and testability design approaches for functional and internal fault testing and shows how contactless testing might resolve many of the challenges associated with conventional mechanical wafer testing. The techniques described in this book address the increasing demands for internal access of the logic state of a node within a chip under test: Provides a single-source reference on contactless probing approaches for VLSI testing and diagnostic measurement Introduces readers to various optical contactless testing techniques, such as Electro-Optic Probing, Charge Density Probe, and Photo-emissive Probe Discusses the applicability and adaptability of each technique, based on multilayer metallization, wafer level techniques, and invasiveness Provides a comparison among various contactless testing techniques Describes a variety of industrial applications of contactless VLSI testing.
988			_aEBSPRINGER_2018
650		7	_2embne _9139614 _aCircuitos integrados
776	0	8	_iEdición impresa: _z9783319696720
776	0	8	_iEdición impresa: _z9783319696744
776	0	8	_iEdición impresa: _z9783319888194
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-3-319-69673-7 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
942			_2lcc _cLE