000			03305nam a22003975i 4500
710	2		_aSpringerLink (Online service) _0http://id.loc.gov/authorities/names/no2005046756 _1http://viaf.org/viaf/274647764/ _9106996
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005			20230102113037.0
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008			180427s2018 gw | s |||| 0|eng d
020			_a9783319778723
024	7		_a10.1007/978-3-319-77872-3 _2doi
040			_bspa _cES-MaUEC _dES-MaUEC
050		4	_aTK7870 _b2018 EB
100	1		_aSeok, Seonho _9673375
245	1	0	_aAdvanced Packaging and Manufacturing Technology Based on Adhesion Engineering : _bWafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method _cby Seonho Seok
264		1	_aCham _bSpringer International Publishing _c2018
300			_a1 recurso en línea (VIII, 115 páginas) _b106 ilustraciones
336			_2rdacontent _aTexto _btxt
337			_2rdamedia _aelectrónico _bc
338			_2rdacarrier _arecurso electrónico _bcr
347			_atext file _bPDF
490	0		_aSpringer Series in Advanced Manufacturing, _x1860-5168
490	0		_aEngineering (Springer-11647)
505	0		_aOverview of MEMS packaging technologies -- Adhesion control techniques for debonding -- FEM modeling of debonding -- Polymer cap transfer packaging technologies -- Thin film cap transfer packaging technology -- Other related manufacturing technologies. .
520	3		_aThis book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding behavior, and then presents BCB cap deformation and stress development at different opening displacements as a function of BCB thickness, which is a criterion for BCB cap transfer failure. Transfer packaging techniques are attracting increasing interest because they deliver packaging caps, from carrier wafers to device wafers, and minimize the fabrication issues frequently encountered in thin-film or polymer cap encapsulation. The book describes very-low-loss polymer cap or thin-film-transfer techniques based on anti-adhesion coating methods for radio frequency (RF) (-MEMS) device packaging. Since the polymer caps are susceptible to deformation due to their relatively low mechanical stiffness during debonding of the carrier wafer, the book develops an appropriate finite element model (FEM) to simulate the debonding process occurring in the interface between Si carrier wafer and BCB cap. Lastly, it includes the load-displacement curve of different materials and presents a flexible polymer filter and a tunable filter as examples of the applications of the proposed technology.
988			_aEBSPRINGER_2018
650		7	_2embne _aComponentes electrónicos _9153705
776	0	8	_iEdición impresa: _z9783319778716
776	0	8	_iEdición impresa: _z9783319778730
856	4	0	_uhttps://go.openathens.net/redirector/universidadeuropea.es?url=https://doi.org/10.1007/978-3-319-77872-3 _zAcceso a este recurso digital (usuarios Universidad Europea de Madrid)
942			_2lcc _cLE
998			_b04/2020 _dz _eu _zSI