General introduction -- Basic analysis of Single-Input Single-Output (SISO) PCB interconnect structure -- Discrete periodical model of microstrip line with cascaded elementary L-cells -- Modelling of the signal delay induced by PCB interconnect SISO structure -- Analytical modelling methodology of Single-Input Multiple Output (SIMO) symmetric tree interconnects by using lumped element L-cell -- Symmetric tree interconnects modelling with elementary distributed RC-line -- Z/Y/T/S-matrices modelling of symmetric SIMO structure based on elementary distributed RLC-cell -- Z/Y/T/S-matrices analysis of non-symmetric SIMO tree based on elementary distributed element -- Cartographical analyses of reflection and transmission coefficients of shunt coupled lines -- Analytical modelling of interbranch coupling effect on coupled microstrip tree PCB interconnects -- Temperature effect analysis on microstrip structure -- General conclusion.

This book focuses on the modelling methodology of microstrip interconnects, discussing various structures of single-input multiple-output (SIMO) tree interconnects for signal integrity (SI) engineering. Further, it describes lumped and distributed transmission line elements based on single-input single-output (SIMO) models of symmetric and asymmetric trees, and investigates more complicated phenomenon, such as interbranch coupling. The modelling approaches are based on the analytical methods using the Z-, Y- and T-matrices. The established method enables the S-parameters and voltage transfer function of SIMO tree to be determined. Providing illustrative results with frequency and time domain analyses for each tree interconnect structure, the book is a valuable resource for researchers, engineers, and graduate students in fields of analogue, RF/microwave, digital and mixed circuit design, SI and manufacturing engineering. .