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3D microelectronic packaging : from fundamentals to applications / Yan Li, Deepak Goyal, editors.

by Goyal, Deepak, editor literario | Li, Yan, editor literario.

Material type: bookE-book Publisher: Cham, Switzerland : Springer, 2017Items
Location Call no. Status Vol info Loan type
Acceso Electrónico (UEM) TK7874 .D553 2017 EB reference

The Illustrative Book of Cartilage Repair / edited by Deepak Rajkumar Goyal

by Goyal, Deepak Rajkumar, editor literario.

Edition: 1st edition 2021Material type: bookE-book Publisher: Cham : Springer International Publishing, 2021Items
Location Call no. Status Vol info Loan type
Acceso Electrónico (UEM) RD731 2021 EB reference

Pages