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Stochastic Modeling of Thermal Fatigue Crack Growth / by Vasile Radu.

by Radu, Vasile, autor..

Material type: bookE-book Publisher: Cham : Springer International Publishing, 2015Items
Location Call no. Status Vol info Loan type
Acceso Electrónico (UEM) TA418.58 R338 2015 EB reference

Thermal Sensors Principles and Applications for Semiconductor Industries / edited by Chandra Mohan Jha.

by Jha, Chandra Mohan, editor literario.

Material type: bookE-book Publisher: New York, NY : Springer International Publishing, 2015Items
Location Call no. Status Vol info Loan type
Acceso Electrónico (UEM) QC271.6 T447 2015 EB reference

Thermal Stresses : Advanced Theory and Applications / Richard B. Hetnarski, M. Reza Eslami

by SpringerLink (Online service) | Hetnarski, Richard B, autor | Eslami, M. Reza, autor.

Edition: Second editionMaterial type: bookE-book Publisher: Cham : Springer International Publishing : Imprint: Springer, 2019Items
Location Call no. Status Vol info Loan type
Acceso Electrónico (UEM) TA418.58 2019 EB reference

Advanced Thermal Stress Analysis of Smart Materials and Structures / by Zengtao Chen, Abdolhamid Akbarzadeh

by Chen, Zengtao | Akbarzadeh, Abdolhamid, autor.

Edition: 1st ed. 2020.Material type: bookE-book Publisher: Cham : Springer International Publishing, 2020Items
Location Call no. Status Vol info Loan type
Acceso Electrónico (UEM) TA418.54 2020 EB reference

Introduction to Thermal Cloaking : Theory and Analysis in Conduction and Convection / by Woon-Shing Yeung, Ruey-Jen Yang

by Yeung, Woon-Shing, autor | Yang, Ruey-Jen, autor.

Edition: 1st edition 2022Material type: bookE-book Publisher: Singapore : Springer International Publishing, 2022Items
Location Call no. Status Vol info Loan type
Acceso Electrónico (UEM) TA418.54 2022 EB reference

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