Biblioteca CRAI Dulce Chacón - Universidad Europea de Madrid

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3D Stacked Chips : From Emerging Processes to Heterogeneous Systems / edited by Ibrahim (Abe) M Elfadel, Gerhard Fettweis

by SpringerLink (Online service) | Elfadel, Ibrahim (Abe) M, editor literario | Fettweis, Gerhard, editor literario.

Material type: bookE-book Publisher: Cham : Springer International Publishing, 2016
Online access: Acceso a este recurso digital (usuarios Universidad Europea de Madrid)Digital Resources
Items
Location Call no. Status Vol info Loan type
Acceso Electrónico (UEM) TK7888.4 D783 2016 EB reference

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The IoT Physical Layer : Design and Implementation / edited by Ibrahim (Abe) M. Elfadel, Mohammed Ismail

by SpringerLink (Online service) | Elfadel, Ibrahim (Abe) M, editor literario | Ismail, Mohammed, editor literario.

Material type: bookE-book Publisher: Cham : Springer International Publishing ; Imprint: Springer, 2019
Online access: Acceso a este recurso digital (usuarios Universidad Europea de Madrid)Digital Resources
Items
Location Call no. Status Vol info Loan type
Acceso Electrónico (UEM) TK5105.8857 2019 EB reference

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Machine Learning in VLSI Computer-Aided Design / edited by Ibrahim (Abe) M. Elfadel, Duane S. Boning, Xin Li.

by SpringerLink (Online service) | Boning, Duane S, editor literario | Elfadel, Ibrahim (Abe) M, editor literario | Li, Xin, editor literario.

Material type: bookE-book Publisher: Cham : Imprint: Springer, 2019
Online access: Acceso a este recurso digital (usuarios Universidad Europea de Madrid)Digital Resources
Items
Location Call no. Status Vol info Loan type
Acceso Electrónico (UEM) TK7874.75 2019 EB reference

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Secure, Low-Power IoT Communication Using Edge-Coded Signaling / by Shahzad Muzaffar, Ibrahim (Abe) M. Elfadel

by Muzaffar, Shahzad, autor | Elfadel, Ibrahim (Abe) M, autor.

Edition: 1st edition 2022Material type: bookE-book Publisher: Cham : Springer International Publishing, 2022
Online access: Acceso a este recurso digital (usuarios Universidad Europea de Madrid)Digital Resources
Items
Location Call no. Status Vol info Loan type
Acceso Electrónico (UEM) TK5105.8857 2022 EB reference

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