Biblioteca CRAI Dulce Chacón - Universidad Europea de Madrid

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Heterogeneous Integrations / John H. Lau

by SpringerLink (Online service) | Lau, John H, autor.

Material type: bookE-book Publisher: Singapore : Springer Singapore : Imprint: Springer, 2019
Online access: Acceso a este recurso digital (usuarios Universidad Europea de Madrid)Digital Resources
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Location Call no. Status Vol info Loan type
Acceso Electrónico (UEM) TK7874 2019 EB reference

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Assembly and Reliability of Lead-Free Solder Joints / by John H Lau, Ning-Cheng Lee

by Lau, John H, autor | Lee, Ning-Cheng, autor | SpringerLink (Online service).

Edition: First editionMaterial type: bookE-book Publisher: Singapore : Springer Singapore : Imprint: Springer, 2020
Online access: Acceso a este recurso digital (usuarios Universidad Europea de Madrid)Digital Resources
Items
Location Call no. Status Vol info Loan type
Acceso Electrónico (UEM) TS227 2020 EB reference

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Semiconductor Advanced Packaging / by John H. Lau

by Lau, John H, autor.

Edition: First edition 2021Material type: bookE-book Publisher: Singapore : Springer International Publishing, 2021
Online access: Acceso a este recurso digital (usuarios Universidad Europea de Madrid)Digital Resources
Items
Location Call no. Status Vol info Loan type
Acceso Electrónico (UEM) TK7871.85 2021 EB reference

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