Circadian Rhythms for Future Resilient Electronic Systems : Accelerated Active Self-Healing for Integrated Circuits / by Xinfei Guo, Mircea R. Stan.
By: Guo, Xinfei, autor
Contributor(s): Stan, Mircea R., autor
Series: (Engineering (Springer-11647)).Publisher: Cham : Springer International Publishing, 2020Edition: 1st ed. 2020.Description: 1 recurso en línea (XIX, 208 páginas) : 136 ilustraciones, 134 ilustraciones a color.ISBN: 9783030200510.Subject: Circuitos electrónicos -- Problemas
| Item type | Current library | Collection | Call number | Status | Date due | Barcode | Item holds | |
|---|---|---|---|---|---|---|---|---|
LIBRO-E NO PRÉSTAMO
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Madrid Digital Acceso Electrónico (UEM) | Ciencias e Ingeniería | TK7888.4 2020 EB (Browse shelf(Opens below)) | Acceso electrónico | eBook04112035 |
Introduction to Wearout -- Accelerated Self-Healing Techniques for BTI Wearout -- Accelerating and Activating Recovery for EM Wearout -- Circuit Techniques for Accelerated and Active Recovery -- Accelerated Self-Healing as a Key Design Knob for Cross-Layer Resilience -- Design and Aging Challenges in FinFET Circuits and Internet of Things (IoT) Applications -- Future Directions in Self-Healing.
This book describes methods to address wearout/aging degradations in electronic chips and systems, caused by several physical mechanisms at the device level. The authors introduce a novel technique called accelerated active self-healing, which fixes wearout issues by enabling accelerated recovery. Coverage includes recovery theory, experimental results, implementations and applications, across multiple nodes ranging from planar, FD-SOI to FinFET, based on both foundry provided models and predictive models. Presents novel techniques, tested with experiments on real hardware; Discusses circuit and system level wearout recovery implementations, many of these designs are portable and friendly to the standard design flow; Provides circuit-architecture-system infrastructures that enable the accelerated self-healing for future resilient systems; Discusses wearout issues at both transistor and interconnect level, providing solutions that apply to both; Includes coverage of resilient aspects of emerging applications such as IoT.
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