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Modeling and Application of Flexible Electronics Packaging / by YongAn Huang, Zhouping Yin, Xiaodong Wan

By: Huang, YongAn, autor
Contributor(s): Yin, Zhouping, autor | Wan, Xiaodong, autor | SpringerLink (Online service)
Series: (Engineering (Springer-11647)).Publisher: Singapore : Springer Singapore : Imprint: Springer, 2019Description: 1 recurso en línea (XVII, 287 páginas).ISBN: 9789811336270.Subject: ElectrónicaOnline resources: Acceso a este recurso digital (usuarios Universidad Europea de Madrid)Digital Resources
Contents:
Advanced Electronics Packaging -- Interfacial Modeling of Flexible Multilayer Structures -- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy -- Shear-Assisted Peeling -- Single-Needle Peeling -- Multi-Needle Peeling -- Conformal Peeling -- Laser Lift-Off -- Vacuum-Based Picking-up and Placing-on.
Abstract: This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.
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Holdings
Item type Current library Collection Call number Status Date due Barcode Item holds
LIBRO-E NO PRÉSTAMO LIBRO-E NO PRÉSTAMO Madrid Digital Acceso Electrónico (UEM) Ciencias e Ingeniería TK7870.15 2019 EB (Browse shelf(Opens below)) Acceso electrónico eBooks24062457
Total holds: 0

Advanced Electronics Packaging -- Interfacial Modeling of Flexible Multilayer Structures -- Measurement of Strength of Ultra-Thin Silicon Chip and Interfacial Fracture Energy -- Shear-Assisted Peeling -- Single-Needle Peeling -- Multi-Needle Peeling -- Conformal Peeling -- Laser Lift-Off -- Vacuum-Based Picking-up and Placing-on.

This book systematically discusses the modeling and application of transfer manipulation for flexible electronics packaging, presenting multiple processes according to the geometric sizes of the chips and devices as well as the detailed modeling and computation steps for each process. It also illustrates the experimental design of the equipment to help readers easily learn how to use it. This book is a valuable resource for scholars and graduate students in the research field of microelectronics.

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