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More-than-Moore 2.5D and 3D SiP integration / Riko Radojcic.

by Radojcic, Riko.

Material type: bookE-book Publisher: Cham : Springer, 2017Items
Location Call no. Status Vol info Loan type
Acceso Electrónico (UEM) TK7895.E42 R336 2017 EB reference

Managing More-than-Moore Integration Technology Development : A Story of an Advanced Technology program in the Semiconductor Industry / Riko Radojcic

by SpringerLink (Online service) | Radojcic, Riko, autor.

Material type: bookE-book Publisher: Cham : Springer International Publishing : Imprint: Springer, 2019Items
Location Call no. Status Vol info Loan type
Acceso Electrónico (UEM) TK7895 .E42 2019 EB reference

Pages