Biblioteca CRAI Dulce Chacón - Universidad Europea de Madrid

CRAI Library - Madrid
Your cart is empty.
My folder ( items) | My account
Image from Google Jackets

Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces / by Qingke Zhang

By: Zhang, Qingke.
Contributor(s): SpringerLink (Online service)
Material type: materialTypeLabelE-bookSeries: (Springer Theses, Recognizing Outstanding Ph.D. Research, 2190-5053).Publisher: Berlin, Heidelberg : Springer Berlin Heidelberg, 2016Edition: 1st ed.Description: 1 recurso en línea (XV, 143 páginas) : 115 ilustraciones, 81 ilustraciones en color.ISBN: 9783662488232.Subject: Mecánica | Análisis estructural (Ingeniería)DDC classification: 620.1 Online resources: Acceso a este recurso digital (usuarios Universidad Europea de Madrid)Digital Resources
Contents:
Research Progress in Pb-free Soldering -- Fracture Behavior of IMCs at Cu/Pb-free Solder Interface -- Tensile-compress Fatigue Behavior of Solder Joints -- Shear Creep-fatigue Behavior of Cu/Pb-free Solder Joints -- Thermal Fatigue Behavior of Sn-Ag/Cu Solder Joints -- Conclusions.
Abstract: This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.
Tags from this library: No tags from this library for this title. Log in to add tags.
Star ratings
    Average rating: 0.0 (0 votes)
Holdings
Item type Current library Collection Call number Copy number Status Date due Barcode Item holds
LIBRO-E NO PRÉSTAMO LIBRO-E NO PRÉSTAMO Madrid Digital Acceso Electrónico (UEM) Ciencias e Ingeniería TK7836 .Z436 2016 EB (Browse shelf(Opens below)) .i11599510 Acceso electrónico eBOOK .i11599510
Total holds: 0

Research Progress in Pb-free Soldering -- Fracture Behavior of IMCs at Cu/Pb-free Solder Interface -- Tensile-compress Fatigue Behavior of Solder Joints -- Shear Creep-fatigue Behavior of Cu/Pb-free Solder Joints -- Thermal Fatigue Behavior of Sn-Ag/Cu Solder Joints -- Conclusions.

This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.

There are no comments on this title.

to post a comment.